Technical Product Specification

Cooling Subsystem Intel® Server System SR2625UR TPS
Intel order number E46130-010 Revision 1.8
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Table 25. Redundant Fan Header Assignment
Fan ID
Midplane Fan Header Name
Fan #1 - CPU1 Cooling
FAN_1
Fan #2 - CPU1 Cooling
FAN_2
Fan #3 - CPU2 Cooling
FAN_3
Fan #4 - CPU2 Cooling
FAN_4
Fan #5 - PCI Cooling
FAN_5
Fan #6 - PCI Cooling
FAN_6
The system fan module is designed for ease of use and supports several management features
that can be utilized by the Integrated Baseboard Management Controller.
 The fan module houses two different fan sizes: System fans 1, 2, 3 and 4 use an 80-mm
fan; System fans 5 and 6 use a 60-mm fan.
 Each fan is designed for tool-less insertion to or removal from the fan module and can
be hot-swapped in the event of failure.
 Each fan within the module is equipped with a failure LED. In a fan fails, server
management illuminates the fault LED on the failing fan.
 Each fan within the module is capable of supporting multiple speeds. If the external
ambient temperature of the system exceeds the value programmed into the thermal
sensor data record (SDR), the Integrated BMC firmware increases the speed for all the
fans within the fan module.
 Each fan is responsible for cooling a specific zone of the system. If the components in
the zone begin to exceed a safe operating temperature as programmed by the SDR, the
Integrated BMC firmware increases the speed for the fans tied to that zone.
 Each fan connector within the module supplies a tachometer signal that allows the
Integrated BMC to monitor the status of each fan. If one of the fans fails, the remaining
fans increase their rotation and attempt to maintain the thermal requirements of
the system.
4.3 Airflow Support
To control airflow within the system, the system uses an air baffle and a CPU air duct to isolate
and direct airflow to three critical zones: the power supply zone, the full-height PCI riser zone,
and the CPU/memory/low-profile PCI riser zone.
4.3.1 Power Supply Zone
An air baffle is used to isolate the airflow of the main system board zones from the zone directly
in front of the power supply. As the power supply fans pull pre-heated air through the power
supply from inside the system, the zone in front of it must remain as cool as possible by
drawing air from the leftmost drive bays only.
4.3.2 Full-height Riser Zone
The full-height riser zone is the area between the power supply assembly and the full-height
riser card of the riser assembly. The airflow through this area is generated by system fan 3 of
the fan module in a non-redundant fan configuration. In a redundant fan configuration, the
airflow for this zone is provided by system fans 5 and 6. Air is drawn from the drive bay area