Technical Product Specification

Cooling Subsystem Intel® Server System SR1600UR TPS
26 Intel order number E45725-010 Revision 1.8
Note: There is no fan redundancy. Should a fan fail, the system should be powered down as
soon as possible to have the fan replaced. The system fans are not hot-swappable.
4.2 Power Supply Fans
The power supply supports two non-redundant 40-mm fans. They are responsible for the
cooling of the power supply, first hard drive bay, and slimline drive bay.
4.3 CPU Air Duct and Air Baffle
The chassis requires the use of a CPU air duct and power supply/electronics bay isolation air
baffle to direct airflow and sustain appropriate air pressure.
An air baffle is used to isolate airflow of the two power supply fans from that of the system fan
module.
The baffle is mounted into three stand-offs with one end fitting under the back edge of
the hard drive bay.
Figure 13. Air Baffle
The CPU air duct must be properly installed to direct airflow through the processor heatsink(s)
to the low-profile PCI and memory area of the system.
The CPU air duct is designed to support
either a single or dual processor configuration.