Technical Product Specification

Intel® Workstation System SC5650SCWS TPS Introduction
Revision 1.2
Intel order number: E81822-002
1
1. Introduction
This Technical Product Specification (TPS) provides board-specific information detailing the
features, functionality, and high-level architecture of the Intel
®
Workstation System
SC5650SCWS.
In addition, you can obtain design-level information for specific subsystems by ordering the
External Product Specifications (EPS) or External Design Specifications (EDS) for a given
subsystem. EPS and EDS documents are not publicly available and must be ordered through
your local Intel representative.
1.1 Chapter Outline
This document is divided into the following chapters:
Chapter 1 – Introduction
Chapter 2 – Overview
Chapter 3 – Functional Architecture
Chapter 4 – Power Sub-system
Chapter 5 – Platform Management
Chapter 6 – BIOS Setup Utility
Chapter 7 – Connector / Header Locations and Pin-outs
Chapter 8 – Jumper Blocks
Chapter 9 – Intel
®
Light Guided Diagnostics
Chapter 10 – Design and Environmental Specifications
Chapter 11 – Regulatory and Certification Information
Appendix A – Integration and Usage Tips
Appendix B – Processor Active Heat Sink Installation
Appendix C – BMC Sensor Tables
Appendix D – Platform Specific BMC Appendix
Appendix E – POST Code Diagnostic LED Decoder
Appendix F – POST Error Messages and Handling
Appendix G – Installation Guidelines
Glossary
Reference Documents
1.2 Workstation System Use Disclaimer
Intel Corporation workstation systems contain a number of high-density VLSI and power
delivery components that need adequate airflow to cool. Intel ensures through its own chassis
development and testing that when Intel
®
server building blocks are used together, the fully
integrated system will meet the intended thermal requirements of these components. It is the
responsibility of the system integrator who chooses not to use Intel developed server building
blocks to consult vendor datasheets and operating parameters to determine the amount of
airflow required for their specific application and environmental conditions. Intel Corporation