Technical Product Specification

Intel® Server System SR1695WB TPS Introduction
Revision 1.4
Intel order number: E92079-005
1
1. Introduction
This Technical Product Specification (TPS) provides system specific information detailing the
features, functionality, and high-level architecture of the Intel
®
Server System SR1695WB.
You should also reference the Intel
®
Server Board S5500WB Technical Product Specification
to obtain greater detail of functionality and architecture of the server board integrated in this
server system.
In addition, you can obtain design-level information for specific sub-systems by ordering the
External Product Specifications (EPS) or External Design Specifications (EDS) for a given
sub-system. EPS and EDS documents are not publicly available. They are only made
available under NDA with Intel and must be ordered through your local Intel representative.
For a complete list of available documents, refer to the Reference Documents section at the
end of this document.
The Intel
®
Server System SR1695WB may contain design defects or errors known as errata
which may cause the product to deviate from published specifications. Refer to the Intel
®
Server Board S5500WB/Intel
®
Server System SR1695WB Specification Update for
published errata.
1.1 Chapter Outline
This document is divided into the following chapters:
 Chapter 1 – Introduction
 Chapter 2 – Product Overview
 Chapter 3 – Power Sub-System
 Chapter 4 – Cooling Sub-System
 Chapter 5 – Peripheral Driver Support
 Chapter 6 – Hard Disk Driver Support
 Chapter 7 – Front Panel Control and Indicators
 Chapter 8 – Configuration Jumpers
 Chapter 9 – PCI Riser Card and Assembly
 Chapter 10 – Environmental and Regulatory Specifications
 Appendix A – Integration and Usage Tips
 Appendix B – POST code LED Decoder
 Appendix C – Video POST Code Errors
 Appendix D – Jumper Block Settings and Usage
 Glossary
 Reference Documents
1.2 Server Board Use Disclaimer
Intel Corporation server boards support add-in peripherals and contain a number of high-
density VLSI and power delivery components that need adequate airflow to cool. Intel
ensures through its own chassis development and testing that when Intel server building
blocks are used together, the fully integrated system will meet the intended thermal
requirements of these components. It is the responsibility of the system integrator who
chooses not to use Intel developed server building blocks to consult vendor datasheets and
operating parameters to determine the amount of air flow required for their specific
application and environmental conditions. Intel Corporation cannot be held responsible if
components fail or the server board does not operate correctly when used outside any of
their published operating or non-operating limits.