Datasheet

Design and Environmental Specifications Intel® Server Board S5520HC / S5500HCV TPS
Revision 1.2
Intel order number E39529-009
130
9.3.1 Processor Power Support
The server boards support the Thermal Design Power (TDP) guideline for Intel
®
Xeon
®
processors. The Flexible Motherboard Guidelines (FMB) were also followed to determine the
suggested thermal and current design values for anticipating future processor needs. The
following table provides maximum values for I
cc
, TDP power and T
CASE
for the compatible Intel
®
Xeon
®
Processor 5500 series.
Table 72. Intel
®
Xeon
®
Processor Dual Processor TDP Guidelines
Max Tcase
TDP Power
Thermal Profile A Thermal Profile B
Icc Max
95 W
75 ℃ 81 ℃
120 A
9.4 Power Supply Output Requirements
This section is for reference purposes only. The intent is to provide guidance to system
designers to determine a power supply to use with these server boards. This section specifies
the power supply requirements Intel used to develop a power supply for its 5U server system.
The combined power of all outputs should not exceed the rated output power of the power
supply. The power supply must meet both static and dynamic voltage regulation requirements
for the minimum loading conditions.
Table 73. 670-W Load Ratings
Voltage Minimum Continuous Maximum Continuous Peak
+3.3 V 1.0 A 24 A
+5 V 2.0 A 30 A
+12 V1 0.5 A 16 A 18 A
+12 V2 1.0 A 16 A 18 A
+12 V3 0.5 A 31 A 33 A
+12 V4 1.0 A 16 A 18 A
-12 V 0 A 0.5 A
+5 VSB 0.1 A 3.0 A 5 A
1. Maximum continuous total output power must not exceed 670 W.
2. Maximum continuous load on the combined 12-V output must not exceed 48 A.
3. Peak load on the combined 12-V output must not exceed 52 A.
4. Peak total DC output power must not exceed 730 W.
5. For 12 V, peak power and current loading are supported for a minimum of 12 seconds.
6. For 5 VSB, 5 VSB must withstand 5 A for 500 ms under the first turn-on condition.
7. Combined 3.3 V and 5 V power must not exceed 170 W.