Technical Product Specification
Table Of Contents
- 1. Introduction
- 2. Product Overview
- 3. Functional Architecture
- 3.1 Processor Support
- 3.1.1 Processor Population Rules
- 3.1.2 Multiple Processor Initialization
- 3.1.3 Enhanced Intel SpeedStep® Technology
- 3.1.4 Intel® Extended Memory 64 Technology (Intel® EM64T)
- 3.1.5 Execute Disable Bit Feature
- 3.1.6 Multi-Core Processor Support
- 3.1.7 Intel® Virtualization Technology
- 3.1.8 Platform Environmental Control Interface (PECI)
- 3.1.9 Common Enabling Kit (CEK) Design Support
- 3.2 Intel® 5400 Memory Controller Hub Chipset (Intel® 5400 MCH Chipset)
- 3.2.1 Processor Front-Side Buses
- 3.2.2 Snoop Filter
- 3.2.3 System Memory Controller and Memory Subsystem
- 3.2.3.1 Supported Memory
- 3.2.3.2 DIMM Population Rules and Supported DIMM Configurations
- 3.2.3.3 Minimum Memory Configuration
- 3.2.3.4 Memory upgrades
- 3.2.3.5 ECC Code Support
- 3.2.3.6 Memory Sparing
- 3.2.3.7 FBD Memory Thermal Management
- 3.2.3.8 BIOS Support of Memory Subsystem
- 3.2.3.9 Memory Error Handing
- 3.2.3.10 Memory Error Reporting
- 3.3 Intel® 6321ESB I/O Controller Hub
- 3.4 PCI Subsystem
- 3.4.1 Intel® 6321ESB I/O Controller Hub PCI32: 32-bit, 33-MHz PCI Bus Segment
- 3.4.2 Intel® 6321ESB I/O Controller Hub Port 1: x4 PCI Express* Bus Segment
- 3.4.3 Intel® 6321ESB I/O Controller Hub Port 2: x4 PCI Express* Bus Segment
- 3.4.4 MCH to Intel® 6321ESB I/O Controller Hub Chip-to-Chip Interface: Two x4 PCI Express* Bus Segments
- 3.4.5 MCH Ports 5-8: x16 Gen 2 PCI Express* Bus Segment
- 3.4.6 Scan Order
- 3.4.7 Resource Assignment
- 3.4.8 Automatic IRQ Assignment
- 3.4.9 Legacy Option ROM Support
- 3.4.10 EFI PCI APIs
- 3.4.11 Legacy PCI APIs
- 3.5 Video Support
- 3.6 Network Interface Controller (NIC)
- 3.7 Super I/O
- 3.1 Processor Support
- 4. Server Management
- 4.1 Intel® 6321ESB I/O Controller Hub Integrated Baseboard Management Controller (Integrated BMC) Feature Set
- 4.2 Advanced Configuration and Power Interface (ACPI)
- 4.3 System Initialization
- 4.4 Integrated Front Panel User Interface
- 4.5 Platform Control
- 4.6 Standard Fan Management
- 4.7 Private Management I2C Buses
- 4.8 Integrated BMC Messaging Interfaces
- 4.9 Event Filtering and Alerting
- 4.10 Watchdog Timer
- 4.11 System Event Log (SEL)
- 4.12 Sensor Data Record (SDR) Repository
- 4.13 Field Replaceable Unit (FRU) Inventory Device
- 4.14 Non-maskable Interrupt (NMI)
- 4.15 General Sensor Behavior
- 4.16 Processor Sensors
- 4.16.1 Processor Status Sensors
- 4.16.2 Processor VRD Over-temperature Sensor
- 4.16.3 ThermalTrip Monitoring
- 4.16.4 Internal Error (IERR) Monitoring
- 4.16.5 Dynamic Processor Voltage Monitoring
- 4.16.6 Processor Temperature Monitoring
- 4.16.7 Processor Thermal Control Monitoring (ProcHot)
- 4.16.8 CPU Population Error Sensor
- 4.17 Intel® Remote Management Module 2 (Intel RMM2) Support
- 5. System BIOS
- 5.1 BIOS Identification String
- 5.2 BIOS User Interface
- 5.2.1 Logo/Diagnostic Screen
- 5.2.2 BIOS Setup Utility
- 5.2.3 Server Platform Setup Utility Screens
- 5.2.3.1 Main Screen
- 5.2.3.2 Advanced Screen
- 5.2.3.3 Security Screen
- 5.2.3.4 Server Management Screen
- 5.2.3.5 Server Management System Information Screen
- 5.2.3.6 Boot Options Screen
- 5.2.3.7 Boot Manager Screen
- 5.2.3.8 Error Manager Screen
- 5.2.3.9 Exit Screen
- 5.3 Loading BIOS Defaults
- 5.4 Rolling BIOS
- 5.5 OEM Binary
- 6. Connector/Header Locations and Pin-outs
- 7. Jumper Block Settings
- 8. Intel® Light-Guided Diagnostics
- 9. Power and Environmental Specifications
- 9.1 Intel® Server Board S5400SF Design Specifications
- 9.2 Server Board Power Requirements
- 9.2.1 Processor Power Support
- 9.2.2 Power Supply DC Output Requirements
- 9.2.3 Power-on Loading
- 9.2.4 Grounding
- 9.2.5 Standby Outputs
- 9.2.6 Remote Sense
- 9.2.7 Voltage Regulation
- 9.2.8 Dynamic Loading
- 9.2.9 Capacitive Loading
- 9.2.10 Closed-Loop Stability
- 9.2.11 Common Mode Noise
- 9.2.12 Ripple/Noise
- 9.2.13 Soft Starting
- 9.2.14 Timing Requirements
- 9.2.15 Residual Voltage Immunity in Standby Mode
- 10. Regulatory and Certification Information
- Appendix A: Integration and Usage Tips
- Appendix B: POST Code Diagnostic LED Decoder
- Appendix C: POST Error Messages and Handling
- Appendix D: EFI Shell Commands
- Appendix E: Supported Intel® Server Chassis
- Appendix F: 1U PCI Express* Gen 2 Riser Card
- Glossary
- Reference Documents
Functional Architecture Intel
®
Server Board S5400SF TPS
Revision 2.02
Intel order number: D92944-007
26
When the branch operates in the single-channel mode, the MCH supports an 8-byte-over-32-
byte Single Error Correct, Double Error Detect (SECDED+) code. It is the same ECC code that
is used in the dual-channel mode, but the number of devices over which the codeword is
defined is half, thereby reducing the SDDC properties to SECDED+. A single wire fault in the
same device is replicated across all symbols reducing the effectiveness of the error correction.
In the single DIMM mode (e.g. nine x8 devices), single wire fault (stuck at) errors or permanent
full device faults cannot be corrected. This code has the following properties:
Detection of any two bits in error within 8 bytes of data
Correction of any single bit in error within 8 bytes of data
Correction to any single DRAM data bus wire failure
3.2.3.6 Memory Sparing
The MCH provides DIMM sparing capabilities. DIMM Sparing is a RAS feature that places
DIMMs in reserve to replace DIMMs that are failing. Spared memory configurations do not
provide redundant copies of memory and the system cannot continue to operate when an
uncorrectable error occurs. The purpose of memory sparing is to detect a degrading FBDIMM
before it causes a system crash. Once the affected FBDIMM is isolated and removed from the
set of active FBDIMMs, the system integrity is maintained by copying the data from the failed
FBDIMM to the reserved FBDIMM. DIMM sparing occurs within a given channel of memory and
is not supported across branches.
The DIMM sparing feature requires that the spare FBDIMM be at least the size of the largest
primary FBDIMM in use. When sparing is enabled, the BIOS selects the spare automatically
during POST. No manual configuration of this feature is required beyond enabling the feature in
the BIOS setup. With sparing enabled, the total effective memory size is reduced by the size of
the spare FBDIMM(s).
For FBDIMM sparing, the minimum population is at least two FBDIMMs on the same channel on
any branch. Selecting the Memory RAS Sparing option from the BIOS setup causes the BIOS to
attempt enabling the feature on both branches to begin with, but actual configuration for a given
branch depends upon the population of FBDIMMs on that branch.
See Table 8 in section 1.1.1.1 for valid memory configurations that support the Memory Sparing
feature.
The spare FBDIMMs do not contribute to available physical memory under normal system
operation. The Effective Memory field on the BIOS Setup screen indicates this absence of
memory for the sparing operation.
When a dual-ranked FBDIMM is used as a spare, the BIOS has the ability to independently
select a physical rank on that FBDIMM as the spare unit and utilize the other physical rank as a
normal unit. This selective sparing ensures maximization of available memory while still
providing RAS.