Technical Product Specification
Table Of Contents
- 1. Introduction
- 2. Product Overview
- 3. Functional Architecture
- 3.1 Processor Support
- 3.1.1 Processor Population Rules
- 3.1.2 Multiple Processor Initialization
- 3.1.3 Enhanced Intel SpeedStep® Technology
- 3.1.4 Intel® Extended Memory 64 Technology (Intel® EM64T)
- 3.1.5 Execute Disable Bit Feature
- 3.1.6 Multi-Core Processor Support
- 3.1.7 Intel® Virtualization Technology
- 3.1.8 Platform Environmental Control Interface (PECI)
- 3.1.9 Common Enabling Kit (CEK) Design Support
- 3.2 Intel® 5400 Memory Controller Hub Chipset (Intel® 5400 MCH Chipset)
- 3.2.1 Processor Front-Side Buses
- 3.2.2 Snoop Filter
- 3.2.3 System Memory Controller and Memory Subsystem
- 3.2.3.1 Supported Memory
- 3.2.3.2 DIMM Population Rules and Supported DIMM Configurations
- 3.2.3.3 Minimum Memory Configuration
- 3.2.3.4 Memory upgrades
- 3.2.3.5 ECC Code Support
- 3.2.3.6 Memory Sparing
- 3.2.3.7 FBD Memory Thermal Management
- 3.2.3.8 BIOS Support of Memory Subsystem
- 3.2.3.9 Memory Error Handing
- 3.2.3.10 Memory Error Reporting
- 3.3 Intel® 6321ESB I/O Controller Hub
- 3.4 PCI Subsystem
- 3.4.1 Intel® 6321ESB I/O Controller Hub PCI32: 32-bit, 33-MHz PCI Bus Segment
- 3.4.2 Intel® 6321ESB I/O Controller Hub Port 1: x4 PCI Express* Bus Segment
- 3.4.3 Intel® 6321ESB I/O Controller Hub Port 2: x4 PCI Express* Bus Segment
- 3.4.4 MCH to Intel® 6321ESB I/O Controller Hub Chip-to-Chip Interface: Two x4 PCI Express* Bus Segments
- 3.4.5 MCH Ports 5-8: x16 Gen 2 PCI Express* Bus Segment
- 3.4.6 Scan Order
- 3.4.7 Resource Assignment
- 3.4.8 Automatic IRQ Assignment
- 3.4.9 Legacy Option ROM Support
- 3.4.10 EFI PCI APIs
- 3.4.11 Legacy PCI APIs
- 3.5 Video Support
- 3.6 Network Interface Controller (NIC)
- 3.7 Super I/O
- 3.1 Processor Support
- 4. Server Management
- 4.1 Intel® 6321ESB I/O Controller Hub Integrated Baseboard Management Controller (Integrated BMC) Feature Set
- 4.2 Advanced Configuration and Power Interface (ACPI)
- 4.3 System Initialization
- 4.4 Integrated Front Panel User Interface
- 4.5 Platform Control
- 4.6 Standard Fan Management
- 4.7 Private Management I2C Buses
- 4.8 Integrated BMC Messaging Interfaces
- 4.9 Event Filtering and Alerting
- 4.10 Watchdog Timer
- 4.11 System Event Log (SEL)
- 4.12 Sensor Data Record (SDR) Repository
- 4.13 Field Replaceable Unit (FRU) Inventory Device
- 4.14 Non-maskable Interrupt (NMI)
- 4.15 General Sensor Behavior
- 4.16 Processor Sensors
- 4.16.1 Processor Status Sensors
- 4.16.2 Processor VRD Over-temperature Sensor
- 4.16.3 ThermalTrip Monitoring
- 4.16.4 Internal Error (IERR) Monitoring
- 4.16.5 Dynamic Processor Voltage Monitoring
- 4.16.6 Processor Temperature Monitoring
- 4.16.7 Processor Thermal Control Monitoring (ProcHot)
- 4.16.8 CPU Population Error Sensor
- 4.17 Intel® Remote Management Module 2 (Intel RMM2) Support
- 5. System BIOS
- 5.1 BIOS Identification String
- 5.2 BIOS User Interface
- 5.2.1 Logo/Diagnostic Screen
- 5.2.2 BIOS Setup Utility
- 5.2.3 Server Platform Setup Utility Screens
- 5.2.3.1 Main Screen
- 5.2.3.2 Advanced Screen
- 5.2.3.3 Security Screen
- 5.2.3.4 Server Management Screen
- 5.2.3.5 Server Management System Information Screen
- 5.2.3.6 Boot Options Screen
- 5.2.3.7 Boot Manager Screen
- 5.2.3.8 Error Manager Screen
- 5.2.3.9 Exit Screen
- 5.3 Loading BIOS Defaults
- 5.4 Rolling BIOS
- 5.5 OEM Binary
- 6. Connector/Header Locations and Pin-outs
- 7. Jumper Block Settings
- 8. Intel® Light-Guided Diagnostics
- 9. Power and Environmental Specifications
- 9.1 Intel® Server Board S5400SF Design Specifications
- 9.2 Server Board Power Requirements
- 9.2.1 Processor Power Support
- 9.2.2 Power Supply DC Output Requirements
- 9.2.3 Power-on Loading
- 9.2.4 Grounding
- 9.2.5 Standby Outputs
- 9.2.6 Remote Sense
- 9.2.7 Voltage Regulation
- 9.2.8 Dynamic Loading
- 9.2.9 Capacitive Loading
- 9.2.10 Closed-Loop Stability
- 9.2.11 Common Mode Noise
- 9.2.12 Ripple/Noise
- 9.2.13 Soft Starting
- 9.2.14 Timing Requirements
- 9.2.15 Residual Voltage Immunity in Standby Mode
- 10. Regulatory and Certification Information
- Appendix A: Integration and Usage Tips
- Appendix B: POST Code Diagnostic LED Decoder
- Appendix C: POST Error Messages and Handling
- Appendix D: EFI Shell Commands
- Appendix E: Supported Intel® Server Chassis
- Appendix F: 1U PCI Express* Gen 2 Riser Card
- Glossary
- Reference Documents
Intel
®
Server Board S5400SF TPS Functional Architecture
Revision 2.02
Intel order number: D92944-007
17
Note: If the setup option is changed to enable or disable the Intel
®
Virtualization Technology
setting in the processor, the user must perform an AC power cycle for the change to take effect.
3.1.8 Platform Environmental Control Interface (PECI)
PECI is a thermal management interface that uses a single wire bus interface to provide a
communication channel between an Intel
®
processor and an external monitoring device (PECI
host controller). The PECI host controller on this server board is ADT7490*. Intel
®
Xeon
®
processors 5000 sequence provides processor temperature via the PECI interface.
The PECI feature configuration and support is controlled via the processor MSR (Model Specific
Registers). All installed processors must support PECI. The BIOS polls all installed processors
for PECI support. If the PECI feature is supported, then the BIOS enables PECI by
programming the MSRs.
The processor temperature monitoring and management is accomplished by the Integrated
BMC firmware. It is the responsibility of the Integrated BMC firmware to enable the PECI polling
circuitry.
3.1.9 Common Enabling Kit (CEK) Design Support
The server board complies with Intel’s Common Enabling Kit (CEK) processor mounting and
heatsink retention solution. The server board ships with a CEK spring snapped onto the
underside of the server board, beneath each processor socket. The heatsink attaches to the
CEK, over the top of the processor and the thermal interface material (TIM). See the following
figure for the stacking order of the chassis, CEK spring, server board, TIM, and heatsink.
The CEK spring is removable, allowing for the use of non-Intel heatsink retention solutions.
Note: The processor heatsink and CEK spring shown in the following figure are for reference
purposes only. The actual processor heatsink and CEK solutions compatible with this
generation server board may be of a different design.