Technical Product Specification
Table Of Contents
- 1. Introduction
- 2. Product Overview
- 3. Functional Architecture
- 3.1 Processor Support
- 3.1.1 Processor Population Rules
- 3.1.2 Multiple Processor Initialization
- 3.1.3 Enhanced Intel SpeedStep® Technology
- 3.1.4 Intel® Extended Memory 64 Technology (Intel® EM64T)
- 3.1.5 Execute Disable Bit Feature
- 3.1.6 Multi-Core Processor Support
- 3.1.7 Intel® Virtualization Technology
- 3.1.8 Platform Environmental Control Interface (PECI)
- 3.1.9 Common Enabling Kit (CEK) Design Support
- 3.2 Intel® 5400 Memory Controller Hub Chipset (Intel® 5400 MCH Chipset)
- 3.2.1 Processor Front-Side Buses
- 3.2.2 Snoop Filter
- 3.2.3 System Memory Controller and Memory Subsystem
- 3.2.3.1 Supported Memory
- 3.2.3.2 DIMM Population Rules and Supported DIMM Configurations
- 3.2.3.3 Minimum Memory Configuration
- 3.2.3.4 Memory upgrades
- 3.2.3.5 ECC Code Support
- 3.2.3.6 Memory Sparing
- 3.2.3.7 FBD Memory Thermal Management
- 3.2.3.8 BIOS Support of Memory Subsystem
- 3.2.3.9 Memory Error Handing
- 3.2.3.10 Memory Error Reporting
- 3.3 Intel® 6321ESB I/O Controller Hub
- 3.4 PCI Subsystem
- 3.4.1 Intel® 6321ESB I/O Controller Hub PCI32: 32-bit, 33-MHz PCI Bus Segment
- 3.4.2 Intel® 6321ESB I/O Controller Hub Port 1: x4 PCI Express* Bus Segment
- 3.4.3 Intel® 6321ESB I/O Controller Hub Port 2: x4 PCI Express* Bus Segment
- 3.4.4 MCH to Intel® 6321ESB I/O Controller Hub Chip-to-Chip Interface: Two x4 PCI Express* Bus Segments
- 3.4.5 MCH Ports 5-8: x16 Gen 2 PCI Express* Bus Segment
- 3.4.6 Scan Order
- 3.4.7 Resource Assignment
- 3.4.8 Automatic IRQ Assignment
- 3.4.9 Legacy Option ROM Support
- 3.4.10 EFI PCI APIs
- 3.4.11 Legacy PCI APIs
- 3.5 Video Support
- 3.6 Network Interface Controller (NIC)
- 3.7 Super I/O
- 3.1 Processor Support
- 4. Server Management
- 4.1 Intel® 6321ESB I/O Controller Hub Integrated Baseboard Management Controller (Integrated BMC) Feature Set
- 4.2 Advanced Configuration and Power Interface (ACPI)
- 4.3 System Initialization
- 4.4 Integrated Front Panel User Interface
- 4.5 Platform Control
- 4.6 Standard Fan Management
- 4.7 Private Management I2C Buses
- 4.8 Integrated BMC Messaging Interfaces
- 4.9 Event Filtering and Alerting
- 4.10 Watchdog Timer
- 4.11 System Event Log (SEL)
- 4.12 Sensor Data Record (SDR) Repository
- 4.13 Field Replaceable Unit (FRU) Inventory Device
- 4.14 Non-maskable Interrupt (NMI)
- 4.15 General Sensor Behavior
- 4.16 Processor Sensors
- 4.16.1 Processor Status Sensors
- 4.16.2 Processor VRD Over-temperature Sensor
- 4.16.3 ThermalTrip Monitoring
- 4.16.4 Internal Error (IERR) Monitoring
- 4.16.5 Dynamic Processor Voltage Monitoring
- 4.16.6 Processor Temperature Monitoring
- 4.16.7 Processor Thermal Control Monitoring (ProcHot)
- 4.16.8 CPU Population Error Sensor
- 4.17 Intel® Remote Management Module 2 (Intel RMM2) Support
- 5. System BIOS
- 5.1 BIOS Identification String
- 5.2 BIOS User Interface
- 5.2.1 Logo/Diagnostic Screen
- 5.2.2 BIOS Setup Utility
- 5.2.3 Server Platform Setup Utility Screens
- 5.2.3.1 Main Screen
- 5.2.3.2 Advanced Screen
- 5.2.3.3 Security Screen
- 5.2.3.4 Server Management Screen
- 5.2.3.5 Server Management System Information Screen
- 5.2.3.6 Boot Options Screen
- 5.2.3.7 Boot Manager Screen
- 5.2.3.8 Error Manager Screen
- 5.2.3.9 Exit Screen
- 5.3 Loading BIOS Defaults
- 5.4 Rolling BIOS
- 5.5 OEM Binary
- 6. Connector/Header Locations and Pin-outs
- 7. Jumper Block Settings
- 8. Intel® Light-Guided Diagnostics
- 9. Power and Environmental Specifications
- 9.1 Intel® Server Board S5400SF Design Specifications
- 9.2 Server Board Power Requirements
- 9.2.1 Processor Power Support
- 9.2.2 Power Supply DC Output Requirements
- 9.2.3 Power-on Loading
- 9.2.4 Grounding
- 9.2.5 Standby Outputs
- 9.2.6 Remote Sense
- 9.2.7 Voltage Regulation
- 9.2.8 Dynamic Loading
- 9.2.9 Capacitive Loading
- 9.2.10 Closed-Loop Stability
- 9.2.11 Common Mode Noise
- 9.2.12 Ripple/Noise
- 9.2.13 Soft Starting
- 9.2.14 Timing Requirements
- 9.2.15 Residual Voltage Immunity in Standby Mode
- 10. Regulatory and Certification Information
- Appendix A: Integration and Usage Tips
- Appendix B: POST Code Diagnostic LED Decoder
- Appendix C: POST Error Messages and Handling
- Appendix D: EFI Shell Commands
- Appendix E: Supported Intel® Server Chassis
- Appendix F: 1U PCI Express* Gen 2 Riser Card
- Glossary
- Reference Documents
Revision History Intel
®
Server Board S5400SF TPS
ii Revision 2.02
Intel order number: D92944-007
Revision History
Date Revision
Number
Modifications
September 2007 1.00 Initial release.
July 2008 2.00 Updated supported CPU table.
Added memory type support table.
Updated password clear procedure.
Updated supported BIOS POST error code table.
Updated BIOS Setup Utility options section.
August 2008 2.01 Updated processor naming.
May 2010 2.02 Deleted CCC and CNCA.
Disclaimers
Information in this document is provided in connection with Intel
®
products. No license, express or implied, by
estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's
Terms and Conditions of Sale for such products, Intel assumes no liability whatsoever, and Intel disclaims any
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fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property
right. Intel products are not intended for use in medical, life saving, or life sustaining applications. Intel may make
changes to specifications and product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or
"undefined." Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or
incompatibilities arising from future changes to them.
The Intel
®
Server Board S5400SF may contain design defects or errors known as errata which may cause the product
to deviate from published specifications. Current characterized errata are available on request.
Intel Corporation server boards support peripheral components and contain a number of high-density VLSI and power
delivery components that need adequate airflow to cool. Intel’s own chassis are designed and tested to meet the
intended thermal requirements of these components when the fully integrated system is used together. It is the
responsibility of the system integrator that chooses not to use Intel developed server building blocks to consult vendor
datasheets and operating parameters to determine the amount of air flow required for their specific application and
environmental conditions. Intel Corporation cannot be held responsible if components fail or the server board does
not operate correctly when used outside any of their published operating or non-operating limits.
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*Other brands and names may be claimed as the property of others.
Copyright © Intel Corporation 2010.