Technical Product Specification

Table Of Contents
Intel
®
Server Board S5400SF TPS Glossary
Revision 2.02
Intel order number: D92944-007
169
Glossary
This appendix contains important terms used in this document. For ease of use, numeric entries
are listed first (e.g., “82460GX”) followed by alpha entries (e.g., “AGP 4x”). Acronyms are
followed by non-acronyms.
Term Definition
ACPI Advanced Configuration and Power Interface
AES Advanced Encryption Standard
AL
Additive latency
AMB
Advanced Memory Buffer
AP Application Processor
APIC Advanced Programmable Interrupt Control
ASIC Application Specific Integrated Circuit
ASMI Advanced Server Management Interface
ATA Advanced Technology Attachment
ATAPI Advanced Technology Attachment Packet Interface
BEV Bootstrap Entry Vector
BIOS Basic Input/Output System
BIST Built-In Self Test
BMC Baseboard Management Controller
BRD Buffer read delay
Bridge Circuitry connecting one computer bus to another, allowing an agent on one to access the other
BSP Bootstrap Processor
Byte 8-bit quantity.
CAS Content Addressable Storage
CBC Chassis Bridge Controller (A microcontroller connected to one or more other CBCs, together they
bridge the IPMB buses of multiple chassis.
CEK Common Enabling Kit
CHAP Challenge Handshake Authentication Protocol
CL CAS latency
CLTT Closed Loop Thermal Throttling
CMOS Complementary Metal-oxide Semiconductor
In terms of this specification, this describes the PC-AT compatible region of battery-backed 128 bytes
of memory, which normally resides on the server board.
CRC Cyclic Redundancy Code
CRT Cathode Ray Tube
DHCP Dynamic Host Configuration Protocol
DPC Direct Platform Control
EEPROM Electrically Erasable Programmable Read-Only Memory
EHCI Enhanced Host Controller Interface
EMP Emergency Management Port
EPS External Product Specification
ESB2-E Enterprise South Bridge 2