Technical Product Specification
Table Of Contents
- 1. Introduction
- 2. Product Overview
- 3. Functional Architecture
- 3.1 Processor Support
- 3.1.1 Processor Population Rules
- 3.1.2 Multiple Processor Initialization
- 3.1.3 Enhanced Intel SpeedStep® Technology
- 3.1.4 Intel® Extended Memory 64 Technology (Intel® EM64T)
- 3.1.5 Execute Disable Bit Feature
- 3.1.6 Multi-Core Processor Support
- 3.1.7 Intel® Virtualization Technology
- 3.1.8 Platform Environmental Control Interface (PECI)
- 3.1.9 Common Enabling Kit (CEK) Design Support
- 3.2 Intel® 5400 Memory Controller Hub Chipset (Intel® 5400 MCH Chipset)
- 3.2.1 Processor Front-Side Buses
- 3.2.2 Snoop Filter
- 3.2.3 System Memory Controller and Memory Subsystem
- 3.2.3.1 Supported Memory
- 3.2.3.2 DIMM Population Rules and Supported DIMM Configurations
- 3.2.3.3 Minimum Memory Configuration
- 3.2.3.4 Memory upgrades
- 3.2.3.5 ECC Code Support
- 3.2.3.6 Memory Sparing
- 3.2.3.7 FBD Memory Thermal Management
- 3.2.3.8 BIOS Support of Memory Subsystem
- 3.2.3.9 Memory Error Handing
- 3.2.3.10 Memory Error Reporting
- 3.3 Intel® 6321ESB I/O Controller Hub
- 3.4 PCI Subsystem
- 3.4.1 Intel® 6321ESB I/O Controller Hub PCI32: 32-bit, 33-MHz PCI Bus Segment
- 3.4.2 Intel® 6321ESB I/O Controller Hub Port 1: x4 PCI Express* Bus Segment
- 3.4.3 Intel® 6321ESB I/O Controller Hub Port 2: x4 PCI Express* Bus Segment
- 3.4.4 MCH to Intel® 6321ESB I/O Controller Hub Chip-to-Chip Interface: Two x4 PCI Express* Bus Segments
- 3.4.5 MCH Ports 5-8: x16 Gen 2 PCI Express* Bus Segment
- 3.4.6 Scan Order
- 3.4.7 Resource Assignment
- 3.4.8 Automatic IRQ Assignment
- 3.4.9 Legacy Option ROM Support
- 3.4.10 EFI PCI APIs
- 3.4.11 Legacy PCI APIs
- 3.5 Video Support
- 3.6 Network Interface Controller (NIC)
- 3.7 Super I/O
- 3.1 Processor Support
- 4. Server Management
- 4.1 Intel® 6321ESB I/O Controller Hub Integrated Baseboard Management Controller (Integrated BMC) Feature Set
- 4.2 Advanced Configuration and Power Interface (ACPI)
- 4.3 System Initialization
- 4.4 Integrated Front Panel User Interface
- 4.5 Platform Control
- 4.6 Standard Fan Management
- 4.7 Private Management I2C Buses
- 4.8 Integrated BMC Messaging Interfaces
- 4.9 Event Filtering and Alerting
- 4.10 Watchdog Timer
- 4.11 System Event Log (SEL)
- 4.12 Sensor Data Record (SDR) Repository
- 4.13 Field Replaceable Unit (FRU) Inventory Device
- 4.14 Non-maskable Interrupt (NMI)
- 4.15 General Sensor Behavior
- 4.16 Processor Sensors
- 4.16.1 Processor Status Sensors
- 4.16.2 Processor VRD Over-temperature Sensor
- 4.16.3 ThermalTrip Monitoring
- 4.16.4 Internal Error (IERR) Monitoring
- 4.16.5 Dynamic Processor Voltage Monitoring
- 4.16.6 Processor Temperature Monitoring
- 4.16.7 Processor Thermal Control Monitoring (ProcHot)
- 4.16.8 CPU Population Error Sensor
- 4.17 Intel® Remote Management Module 2 (Intel RMM2) Support
- 5. System BIOS
- 5.1 BIOS Identification String
- 5.2 BIOS User Interface
- 5.2.1 Logo/Diagnostic Screen
- 5.2.2 BIOS Setup Utility
- 5.2.3 Server Platform Setup Utility Screens
- 5.2.3.1 Main Screen
- 5.2.3.2 Advanced Screen
- 5.2.3.3 Security Screen
- 5.2.3.4 Server Management Screen
- 5.2.3.5 Server Management System Information Screen
- 5.2.3.6 Boot Options Screen
- 5.2.3.7 Boot Manager Screen
- 5.2.3.8 Error Manager Screen
- 5.2.3.9 Exit Screen
- 5.3 Loading BIOS Defaults
- 5.4 Rolling BIOS
- 5.5 OEM Binary
- 6. Connector/Header Locations and Pin-outs
- 7. Jumper Block Settings
- 8. Intel® Light-Guided Diagnostics
- 9. Power and Environmental Specifications
- 9.1 Intel® Server Board S5400SF Design Specifications
- 9.2 Server Board Power Requirements
- 9.2.1 Processor Power Support
- 9.2.2 Power Supply DC Output Requirements
- 9.2.3 Power-on Loading
- 9.2.4 Grounding
- 9.2.5 Standby Outputs
- 9.2.6 Remote Sense
- 9.2.7 Voltage Regulation
- 9.2.8 Dynamic Loading
- 9.2.9 Capacitive Loading
- 9.2.10 Closed-Loop Stability
- 9.2.11 Common Mode Noise
- 9.2.12 Ripple/Noise
- 9.2.13 Soft Starting
- 9.2.14 Timing Requirements
- 9.2.15 Residual Voltage Immunity in Standby Mode
- 10. Regulatory and Certification Information
- Appendix A: Integration and Usage Tips
- Appendix B: POST Code Diagnostic LED Decoder
- Appendix C: POST Error Messages and Handling
- Appendix D: EFI Shell Commands
- Appendix E: Supported Intel® Server Chassis
- Appendix F: 1U PCI Express* Gen 2 Riser Card
- Glossary
- Reference Documents
Intel
®
Server Board S5400SF TPS Regulatory and Certification Information
Revision 2.02
Intel order number: D92944-007
153
(MDDS) must be produced to illustrate compliance. Due verification of random materials is
required as a screening/audit to verify suppliers declarations.
The server board complies with the following ecology regulatory requirements:
All materials, parts and subassemblies must not contain restricted materials as defined
in Intel’s Environmental Product Content Specification of Suppliers and Outsourced
Manufacturers – http://supplier.intel.com/ehs/environmental.htm
.
Europe - European Directive 2002/95/EC - Restriction of Hazardous Substances (RoHS)
Threshold limits and banned substances are noted below.
Quantity limit of 0.1% by mass (1000 PPM) for Lead, Mercury, Hexavalent Chromium,
Polybrominated Biphenyls Diphenyl Ethers (PBB/PBDE)
Quantity limit of 0.01% by mass (100 PPM) for Cadmium
China RoHS
All plastic parts that weigh >25 gm shall be marked with the ISO11469 requirements for
recycling. Example >PC/ABS<
EU Packaging Directive
German Green Dot
Japan Recycling
10.1.5 Product Regulatory Compliance Markings
Regulatory Compliance Region Marking
UL Mark USA/Canada
CE Mark Europe
EMC Mark Canada
CANADA ICES-003 CLASS A
CANADA NMB-003 CLASSE A
D33025
BSMI Marking Taiwan
Ctick Marking Australia/New
Zealand
RRL MIC Mark Korea
인증번호: CPU-X38ML (A)
Country of Origin Marking
(Marked on packaging
label)
Exporting
Requirements Made in xxxxx