Technical Product Specification
Table Of Contents
- 1. Introduction
- 2. Product Overview
- 3. Functional Architecture
- 3.1 Processor Support
- 3.1.1 Processor Population Rules
- 3.1.2 Multiple Processor Initialization
- 3.1.3 Enhanced Intel SpeedStep® Technology
- 3.1.4 Intel® Extended Memory 64 Technology (Intel® EM64T)
- 3.1.5 Execute Disable Bit Feature
- 3.1.6 Multi-Core Processor Support
- 3.1.7 Intel® Virtualization Technology
- 3.1.8 Platform Environmental Control Interface (PECI)
- 3.1.9 Common Enabling Kit (CEK) Design Support
- 3.2 Intel® 5400 Memory Controller Hub Chipset (Intel® 5400 MCH Chipset)
- 3.2.1 Processor Front-Side Buses
- 3.2.2 Snoop Filter
- 3.2.3 System Memory Controller and Memory Subsystem
- 3.2.3.1 Supported Memory
- 3.2.3.2 DIMM Population Rules and Supported DIMM Configurations
- 3.2.3.3 Minimum Memory Configuration
- 3.2.3.4 Memory upgrades
- 3.2.3.5 ECC Code Support
- 3.2.3.6 Memory Sparing
- 3.2.3.7 FBD Memory Thermal Management
- 3.2.3.8 BIOS Support of Memory Subsystem
- 3.2.3.9 Memory Error Handing
- 3.2.3.10 Memory Error Reporting
- 3.3 Intel® 6321ESB I/O Controller Hub
- 3.4 PCI Subsystem
- 3.4.1 Intel® 6321ESB I/O Controller Hub PCI32: 32-bit, 33-MHz PCI Bus Segment
- 3.4.2 Intel® 6321ESB I/O Controller Hub Port 1: x4 PCI Express* Bus Segment
- 3.4.3 Intel® 6321ESB I/O Controller Hub Port 2: x4 PCI Express* Bus Segment
- 3.4.4 MCH to Intel® 6321ESB I/O Controller Hub Chip-to-Chip Interface: Two x4 PCI Express* Bus Segments
- 3.4.5 MCH Ports 5-8: x16 Gen 2 PCI Express* Bus Segment
- 3.4.6 Scan Order
- 3.4.7 Resource Assignment
- 3.4.8 Automatic IRQ Assignment
- 3.4.9 Legacy Option ROM Support
- 3.4.10 EFI PCI APIs
- 3.4.11 Legacy PCI APIs
- 3.5 Video Support
- 3.6 Network Interface Controller (NIC)
- 3.7 Super I/O
- 3.1 Processor Support
- 4. Server Management
- 4.1 Intel® 6321ESB I/O Controller Hub Integrated Baseboard Management Controller (Integrated BMC) Feature Set
- 4.2 Advanced Configuration and Power Interface (ACPI)
- 4.3 System Initialization
- 4.4 Integrated Front Panel User Interface
- 4.5 Platform Control
- 4.6 Standard Fan Management
- 4.7 Private Management I2C Buses
- 4.8 Integrated BMC Messaging Interfaces
- 4.9 Event Filtering and Alerting
- 4.10 Watchdog Timer
- 4.11 System Event Log (SEL)
- 4.12 Sensor Data Record (SDR) Repository
- 4.13 Field Replaceable Unit (FRU) Inventory Device
- 4.14 Non-maskable Interrupt (NMI)
- 4.15 General Sensor Behavior
- 4.16 Processor Sensors
- 4.16.1 Processor Status Sensors
- 4.16.2 Processor VRD Over-temperature Sensor
- 4.16.3 ThermalTrip Monitoring
- 4.16.4 Internal Error (IERR) Monitoring
- 4.16.5 Dynamic Processor Voltage Monitoring
- 4.16.6 Processor Temperature Monitoring
- 4.16.7 Processor Thermal Control Monitoring (ProcHot)
- 4.16.8 CPU Population Error Sensor
- 4.17 Intel® Remote Management Module 2 (Intel RMM2) Support
- 5. System BIOS
- 5.1 BIOS Identification String
- 5.2 BIOS User Interface
- 5.2.1 Logo/Diagnostic Screen
- 5.2.2 BIOS Setup Utility
- 5.2.3 Server Platform Setup Utility Screens
- 5.2.3.1 Main Screen
- 5.2.3.2 Advanced Screen
- 5.2.3.3 Security Screen
- 5.2.3.4 Server Management Screen
- 5.2.3.5 Server Management System Information Screen
- 5.2.3.6 Boot Options Screen
- 5.2.3.7 Boot Manager Screen
- 5.2.3.8 Error Manager Screen
- 5.2.3.9 Exit Screen
- 5.3 Loading BIOS Defaults
- 5.4 Rolling BIOS
- 5.5 OEM Binary
- 6. Connector/Header Locations and Pin-outs
- 7. Jumper Block Settings
- 8. Intel® Light-Guided Diagnostics
- 9. Power and Environmental Specifications
- 9.1 Intel® Server Board S5400SF Design Specifications
- 9.2 Server Board Power Requirements
- 9.2.1 Processor Power Support
- 9.2.2 Power Supply DC Output Requirements
- 9.2.3 Power-on Loading
- 9.2.4 Grounding
- 9.2.5 Standby Outputs
- 9.2.6 Remote Sense
- 9.2.7 Voltage Regulation
- 9.2.8 Dynamic Loading
- 9.2.9 Capacitive Loading
- 9.2.10 Closed-Loop Stability
- 9.2.11 Common Mode Noise
- 9.2.12 Ripple/Noise
- 9.2.13 Soft Starting
- 9.2.14 Timing Requirements
- 9.2.15 Residual Voltage Immunity in Standby Mode
- 10. Regulatory and Certification Information
- Appendix A: Integration and Usage Tips
- Appendix B: POST Code Diagnostic LED Decoder
- Appendix C: POST Error Messages and Handling
- Appendix D: EFI Shell Commands
- Appendix E: Supported Intel® Server Chassis
- Appendix F: 1U PCI Express* Gen 2 Riser Card
- Glossary
- Reference Documents
Intel
®
Server Board S5400SF TPS Power and Environmental Specifications
Revision 2.02
Intel order number: D92944-007
147
9.2.8 Dynamic Loading
The output voltages remain within limits for the step loading and capacitive loading specified in
the following table. The load transient repetition rate is tested between 50 Hz and 5 kHz at duty
cycles ranging from 10%-90%. The load transient repetition rate is only a test specification. The
step load may occur anywhere within the minimum load to the maximum load conditions.
Table 87. Transient Load Requirements
Output Step Load Size
(See note 2)
Load Slew Rate Test capacitive Load
+3.3 V 5.0 A
0.25 A/ sec 250 F
+5 V 6.0 A
0.25 A/ sec 400 F
12 V1 +12 V2 +
12 V3 +12 V4
28.0 A
0.25 A/ sec 2200 F
1,2
+5 VSB 0.5 A
0.25 A/ sec 20 F
Notes:
1. Step loads on each 12 V output may happen simultaneously.
2. The +12 V should be tested with 2200 F evenly split between the four +12 V rails.
9.2.9 Capacitive Loading
The power supply is stable and meets all requirements with the following capacitive loading
ranges.
Table 88. Capacitive Loading Conditions
Output Minimum Maximum Units
+3.3V 250 6,800
F
+5V 400 4,700
F
+12V1,2,3,4 500 each 11,000
F
-12V 1 350
F
+5VSB 20 350
F
9.2.10 Closed-Loop Stability
The power supply is unconditionally stable under all line/load/transient load conditions including
capacitive load ranges. A minimum of 45 degrees phase margin and -10dB-gain margin is
required. Closed-loop stability must be ensured at the maximum and minimum loads as
applicable.
9.2.11 Common Mode Noise
The common mode noise on any output does not exceed 350 mV pk-pk over the frequency
band of 10 Hz to 30 MHz.
1. The measurement is made across a 100 Ω resistor between each of the DC outputs,
including ground, at the DC power connector and chassis ground (power subsystem
enclosure).