Technical Product Specification

Intel® Server System SR1560SF TPS Introduction
Revision 1.2
Intel order number D92959-006
1
1. Introduction
This Technical Product Specification (TPS) provides system specific information detailing the
features, functionality, and high level architecture of the Intel
®
Server System SR1560SF. The
Intel
®
Server Board S5400SF Technical Product Specification should also be referenced to
obtain greater detail of functionality and architecture specific to the integrated server board, but
which are also supported on this server system.
In addition, design level information for specific sub-systems can be obtained by ordering the
External Product Specifications (EPS) or External Design Specifications (EDS) for a given sub-
system. EPS and EDS documents are not publicly available. They are only made available
under NDA with Intel and must be ordered through your local Intel representative. See the
Reference Documents section at the end of this document for a complete list of available
documents.
The Intel
®
Server System SR1560SF may contain design defects or errors known as errata
which may cause the product to deviate from published specifications. Refer to the Intel
®
Server
Board S5400SF/Intel
®
Server System SR1560SF Specification Update for published errata.
1.1 Chapter Outline
This document is divided into the following chapters
 Chapter 1 – Introduction
 Chapter 2 – Product Overview
 Chapter 3 – Power Sub-System
 Chapter 4 – Cooling Sub-System
 Chapter 5 – Peripheral Drive Support
 Chapter 6 – Hard Drive Support
 Chapter 7 – Standard Control Panel Functionality
 Chapter 8 – PCI Riser Card and Assembly
 Chapter 9 – Environmental and Regulatory Specifications
 Appendix A – Integration and Usage Tips
 Appendix B – POST Code Diagnostic LED Decoder
 Appendix C – Post Error Beep Codes
 Appendix D – Jumper Block Settings and Usage
 Glossary
 Reference Documents
1.2 Server Board Use Disclaimer
Intel Corporation server boards support add-in peripherals and contain a number of high-density
VLSI and power delivery components that need adequate airflow to cool. Intel ensures through
its own chassis development and testing that when Intel server building blocks are used
together, the fully integrated system will meet the intended thermal requirements of these
components. It is the responsibility of the system integrator who chooses not to use Intel
developed server building blocks to consult vendor datasheets and operating parameters to
determine the amount of air flow required for their specific application and environmental