Tested Memory

The Intel
®
Server Boards S5000PSL, S5000XSL, and S5000XVN, Intel
®
Server Board S5000PSLROMB RAID
Controller, and Intel
®
Storage System SSR212MC2
Main Memory Tested
Fully Buffered ECC, DDR2-667 DIMM Modules
4 GB Sizes (512Mx72)
Manufacturer Part Number
DRAM Part
Number
DRAM
Vendor
PCB Part
Number
AMB
Vendor
AMB
Revision
Heat-sink
Vendor
Rank Date
Qimonda
HYS72T512520E
FD-3S-C2
HYB18T1G400C2
F-3S-C2
Qimonda IDT L4 FDHS Qimonda 2 10/02/08
ATP
Electronics
AP12K72G4BJE6
S7
K4T1G044QQ-
HCE6 rev Q
Samsung D2F24E
Montage
Technolog
y
B2 Foxconn 2 01/27/09
Legacy
Electronics
Inc.
B547RYC9BEP-
30R
K4T1G044QQ-
HCE6 rev Q
Samsung
LE36D2FG
34FRE rev
B (5107
Raw Card
E)
IDT C1 AVC 2 01/12/09
ATP
Electronics
AP12N72G4BJE6
S0
K4T1G044QQ-
HYE6 rev Q
Samsung
M395T5750
EZ0
IDT C1 Samsung 2 02/02/09
1
The GB C0 AMB revision does not support closed-loop throttling.
2
This part may show voltage errors in the System Event Log (SEL) during boot. These errors will not affect system
operation and can be ignored.
Intel® Server Board S5000PAL
Fully Buffered ECC, DDR2-667 DIMM Modules
8 GB Sizes (1G x72)
Manufacturer Part Number
DRAM Part
Number
DRAM
Vendor
PCB Part
Number
AMB
Vendor
AMB
Revision
Heat-sink
Vendor
Rank Date
Smart Modular
Technologies
SG1027FB251252
-SA
K4T4G264QA-
HCE6 rev A
Samsung
M395T5166
AZ0-PO8
IDT C1 Samsung 2 10/28/08
(+) This vendor is part of the CMTL Certification program. This means this part has/will been tested
across all compatible Intel Server Boards. For further information contact CMTL @ http://cmtlabs.com/
Note: Some memory modules may have thermal issues when used in a non-Intel 1U rack solution. It is
advised that you verify any thermal limitations with your chassis supplier before purchasing a chassis.
Note: The use of x4 FBDIMMs will only be supported with the server system operating in “Performance”
mode (default). The use of x4 FBDIMMs while the server system is configured to operate in “Acoustics”
mode is not supported.