Technical Product Specification

Intel® Server Boards S5000PSL and S5000XSL TPS Functional Architecture
Revision 1.7
Intel order number: D41763-008
17
3.1.2.1 Processor Population Rules
When two processors are installed, both must be of identical revision, core voltage, and
bus/core speed. When only one processor is installed, it must be in the socket labeled CPU1.
The other socket must be empty.
The board is designed to provide up to 130A of current per processor. Processors with higher
current requirements are not supported.
No terminator is required in the second processor socket when using a single processor
configuration.
3.1.2.2 Common Enabling Kit (CEK) Design Support
The server board complies with Intel’s Common Enabling Kit (CEK) processor mounting and
heatsink retention solution. The server board ships with a CEK spring snapped onto the
underside of the server board, beneath each processor socket. The heatsink attaches to the
CEK, over the top of the processor and the thermal interface material (TIM). See the following
figure for the stacking order of the chassis, CEK spring, server board, TIM, and heatsink.
The CEK spring is removable, allowing for the use of non-Intel heatsink retention solutions.
Note: The processor heatsink and CEK spring shown in the following figure are for reference
purposes only. The actual processor heatsink and CEK solutions compatible with this
generation server board may be of a different design.
TP02091
Heatsink assembly
Thermal Interface
Material (TIM)
Server Board
CEK Spring
Chassis
AF000196
Figure 11. CEK Processor Mounting