Technical Product Specification

Intel
®
Server Board S2600WP TPS Product Architecture Overview
 I
2
C Compatible Interfaces: For chip, QSFP connector, and chassis configure,
and monitor.
 Management Link: Connect to BMC through SMBus* and NC-SI.
 Others including: MDIO, GPIO, and JTAG.
3.5.2
Quad Small Form-factor Pluggable (QSFP) connector
Port of the Mellanox* ConnectX-3* is connected to a single QSFP connector on Intel
®
Server
Board S2600WPQ and S2600WPF. Below is the application reference between Mellanox*
ConnectX-3* and QSFP:
Figure 19. Connection between Mellanox* ConnectX-3* and QSFP
The QSFP module and all pins shall withstand 500V electrostatic discharge based on Human
Body Model per JEDEC JESD22-A114-B.
The module shall meet ESD requirements given in the EN61000-4-2, criterion B test
specification such that when installed in a properly grounded cage and chassis, the units are
subjected to 12KV air discharges during operation and 8KV direct contact discharges to the
case.
Note: InfiniBand* cables of 2 meters or 3 meters length are recommended to get better EMI
performance.
3.6
Integrated Baseboard Management Controller Overview
The server board utilizes the Baseboard Management features of the Server Engines* Pilot-III
Server Management Controller. The following is an overview of the features as implemented on
the server board from each embedded controller.
Revision 1.6 Intel order number G44057-007 35