Technical Product Specification

Environmental Limits Specification Intel
®
Server Board S2600WP TPS
9. Environmental Limits Specification
Operation of the server board at conditions beyond those shown in the following table may
cause permanent damage to the system. Exposure to absolute maximum rating conditions for
extended periods may affect long term system reliability.
Table 90. Server Board Design Specifications
Operating Temperature
0ºC to 55ºC (32ºF to 131ºF) at product airflow
specification
Non-Operating Temperature
-40ºC to 70ºC (-40ºF to 158ºF)
DC Voltage
± 5% of all nominal voltages
Shock (Unpackaged)
Trapezoidal, 35g, 170 inches/sec
Shock (Packaged)
<20 pounds
>= 20 to <40 pounds
>= 40 to <80 pounds
>= 80 to <100 pounds
>= 100 to <120 pounds
>= 120 pounds
36 inches
30 inches
24 inches
18 inches
12 inches
9 inches
Vibration (Unpackaged)
5 Hz to 500 Hz 3.13 g RMS random
Notes:
1. Intel Corporation server boards contain a number of high-density VLSI and power delivery components that
need adequate airflow to cool. Intel
®
ensures through its own chassis development and testing that when Intel
®
server building blocks are used together, the fully integrated system will meet the intended thermal
requirements of these components. It is the responsibility of the system integrator who chooses not to use
Intel
®
developed server building blocks to consult vendor datasheets and operating parameters to determine
the amount of airflow required for their specific application and environmental conditions. Intel Corporation
cannot be held responsible, if components fail or the server board does not operate correctly when used
outside any of its published operating or non-operating limits.
2. The Energy Star compliance is at the systems level and not the board level. Use of Intel
®
boards alone does
not guarantee Energy Star compliance.
3. Chassis design must provide proper airflow to avoid exceeding the Intel
®
Xeon
®
processor maximum case
temperature.
Disclaimer Note: Intel
®
ensures the unpackaged server board and system meet the shock
requirement mentioned above through its own chassis development and system configuration. It
is the responsibility of the system integrator to determine the proper shock level of the board
and system if the system integrator chooses different system configuration or different chassis.
Intel Corporation cannot be held responsible if components fail or the server board does not
operate correctly when used outside any of its published operating or non-operating limits.
9.1
System Level Environmental Considerations
In order to maintain comprehensive thermal protection, deliver the best system acoustics, and
fan power efficiency, an intelligent Fan Speed Control (FSC) and thermal management
technology (mechanism) is used. Options in <F2> BIOS Setup (BIOS > Advanced > System
Acoustic and Performance Configuration) allow for parameter adjustments based on the
actual system configuration and usage. Refer to the following sections for a description of each
setting.
Intel order number G44057-007 Revision 1.6
166