Technical Product Specification

Intel
®
Server System H2000WP Family TPS Product Overview
Parameter
Limits
Air Discharged 8.0 kV
Contact
Discharge
8.0 kV
Altitude
Operating -16 to 3048 m (-50 to 10,000 ft)
Note: For altitudes above 2950 feet, the maximum operating temperature is de-
rated 1°F/550 ft.
Storage -16 to 10,600 m (-50 to 35,000 ft)
Acoustics
Sound
Power
Measured
– –
Air Flow Operation H2312xxKR: 8 to 41 CFM per node
H2216xxKR: 8 to 61 CFM per node
Power in
Watts
All range
Servers/Rack
Mount BA
- 3.5" HDD SKU: 6.9BA at idle and 7.4BA at active mode.
- 2.5" HDD SKU: 6.5BA at idle and 7.07BA at active mode.
Note:
1. Intel Corporation server boards contain a number of high-density VLSI and power delivery components that
need adequate airflow to cool. Intel
®
ensures through its own chassis development and testing that when
Intel
®
server building blocks are used together, the fully integrated system will meet the intended thermal
requirements of these components. It is the responsibility of the system integrator who chooses not to use
Intel
®
developed server building blocks to consult vendor datasheets and operating parameters to determine
the amount of airflow required for their specific application and environmental conditions. Intel Corporation
cannot be held responsible, if components fail or the server board does not operate correctly when used
outside any of its published operating or non-operating limits.
Disclaimer Note: Intel
®
ensures the unpackaged server board and system meet the shock
requirement mentioned above through its own chassis development and system configuration. It
is the responsibility of the system integrator to determine the proper shock level of the board
and system if the system integrator chooses different system configuration or different chassis.
Intel Corporation cannot be held responsible if components fail or the server board does not
operate correctly when used outside any of its published operating or non-operating limits.
In order to maintain comprehensive thermal protection, deliver the best system acoustics, and
fan power efficiency, an intelligent Fan Speed Control (FSC) and thermal management
technology (mechanism) is used. Options in <F2> BIOS Setup (BIOS > Advanced > System
Acoustic and Performance Configuration) allow for parameter adjustments based on the
actual system configuration and usage. Refer to the following sections for a description of
each setting.
2.3.1 High Temperature Ambience (HTA) Support
To keep the system operating within supported maximum thermal limits, the system must meet
the following operating and configuration guidelines:
 The system operating ambient is designed for sustained operation up to 35ºC (ASHRAE
Class A2) with short term excursion based operation up to 45ºC (ASHRAE Class A4).
Revision 1.6 Intel order number: G52418-006 7