Technical Product Specification

Environmental Limits Specification Intel® Server Board S2600CO Family TPS
Revision 1.6
Intel order number G42278-004
106
fully integrated system will meet the intended thermal requirements of these components. It is
the responsibility of the system integrator who chooses not to use Intel
®
developed server
building blocks to consult vendor datasheets and operating parameters to determine the amount
of airflow required for their specific application and environmental conditions. Intel Corporation
cannot be held responsible, if components fail or the server board does not operate correctly
when used outside any of their published operating or non-operating limits.
11.2 MTBF
The following is the calculated Mean Time Between Failures (MTBF) 30C (ambient air). These
values are derived using a historical failure rate and multiplied by factors for application,
electrical and/or thermal stress and for device maturity. You should view MTBF estimates as
“reference numbers” only.
 Calculation Model: Telcordia* Issue 1, method I case 3
 Operating Temperature: Server in 30°C ambient air
 Operating Environment: Ground Benign, Controlled
 Duty Cycle: 100%
 Quality Level: II
Table 59. MTBF Estimate
Assembly Name
Failure Rate
MTBF
Mother board
4,447.80
224,830
Integrated Circuits
946.69
1,056,313
Transistor Bipolar
127.02
7,782,934
Transistor_MOSFET
389.76
2,565,714
Diodes
31.49
31,756,974
Diodes_LED
30.00
33,330,661
Resistors
1041.23
960,398
Capacitors
341.86
2,925,173
E-Cap
461.62
2,166,305
Inductors
89.89
11,125,319
Connections
1,176.13
850,245
Misc
80.72
12,388,387