Technical Product Specification

Table of Contents Intel
®
Server System R1000EP Product Family TPS
iv Intel Order Number G67599-003 Revision 2.0
Table of Contents
1. Introduction ........................................................................................................................ 1
1.1 Chapter Outline ...................................................................................................... 1
1.2 Server Board Use Disclaimer ................................................................................. 1
1.3 Product Errata ........................................................................................................ 2
2. Product Family Overview ................................................................................................... 3
2.1 Chassis Dimensions ............................................................................................... 6
2.2 System Level Environmental Limits ........................................................................ 7
2.3 System Features and Options Overview ................................................................ 8
2.3.1 Hot Swap Hard Drive Bay and Front Panel Options ............................................... 9
2.3.2 Back Panel Features .............................................................................................. 9
2.3.3 Front Control Panel Options ................................................................................. 10
2.4 Server Board Features Overview ......................................................................... 11
2.5 Available Front Bezel Support .............................................................................. 12
2.6 Available Rack and Cabinet Mounting Kit Options ................................................ 13
3. Power Subsystem ............................................................................................................. 14
3.1 Mechanical Overview ........................................................................................... 14
3.2 Main Power Layout .............................................................................................. 16
3.3 Power Connectors ................................................................................................ 16
3.3.1 Power Supply Module Card Edge Connector ....................................................... 16
3.3.2 Hot Swap Backplane Power Connector ................................................................ 17
3.3.3 Optical Drive Power Connector ............................................................................ 18
3.4 Power Supply Module Efficiency .......................................................................... 18
3.5 Power Cord Specification Requirements .............................................................. 18
3.6 AC Input Requirement .......................................................................................... 18
3.6.1 Power Factor ........................................................................................................ 18
3.6.2 AC Input Voltage Specification ............................................................................. 19
3.6.3 AC Line Dropout/Holdup ...................................................................................... 19
3.6.4 AC Line Transient Specification ........................................................................... 19
3.6.5 AC Line Surge Immunity ...................................................................................... 20
3.6.6 AC Inrush ............................................................................................................. 20
3.6.7 Susceptibility Requirements ................................................................................. 20
3.6.8 Electrostatic Discharge Susceptibility ................................................................... 20
3.6.9 Protection Circuits ................................................................................................ 20
3.6.10 Over-current Protection (OCP) ............................................................................. 20
3.6.11 Over-voltage Protection (OVP) ............................................................................. 21
3.6.12 Over-temperature Protection (OTP) ..................................................................... 21
4. Thermal Management ....................................................................................................... 22
4.1 Thermal Operation and Configuration Requirements ............................................ 22