Technical Product Specification

Thermal Management Intel
®
Server System R1000EP Product Family TPS
22 Intel Order Number G67599-003 Revision 2.0
4. Thermal Management
The fully integrated system is designed to operate at external ambient temperatures of between
10ºC and 35ºC with limited excursion based operation up to 45ºC, as specified in Table 2.
Working with integrated platform management, several features within the system are designed
to move air in a front to back direction, through the system and over critical components in order
to prevent them from overheating and allow the system to operate with best performance.
The Intel
®
Server System R1000EP product family supports short-term, excursion-based,
operation up to 45°C (ASHRAE A4) with limited performance impact. The configuration
requirements and limitations are described in the configuration matrix found in the Intel
®
S2400EP Product Family Power Budget and Thermal Configuration Tool, available as a
download online at http://www.intel.com/p/en_US/support/.
The installation and functionality of several system components are used to maintain system
thermals. They include five managed single rotor 40mm x 28mm system fans, an air duct,
populated hard drive carriers, and installed CPU heats sinks. Hard drive carriers can be
populated with a hard drive or supplied drive blank. In addition, it may be necessary to have
specific DIMM slots populated with DIMMs or supplied DIMM blanks.
4.1 Thermal Operation and Configuration Requirements
To keep the system operating within supported maximum thermal limits, the system must meet
the following operating and configuration guidelines:
 The system operating ambient is designed for sustained operation up to 35ºC (ASHRAE
Class A2) with short term excursion based operation up to 45ºC (ASHRAE Class A4).
o The system can operate up to 40ºC (ASHRAE Class A3) for up to 900 hours
per year
o The system can operate up to 45ºC (ASHRAE Class A4) for up to 90 hours
per year
o When operating within the extended operating temperature range, then system
performance may be impacted.
o There is no long term system reliability impact when operating at the extended
temperature range within the approved limits.
 Specific configuration requirements and limitations are documented in the configuration
matrix found in the Intel
®
Server Board S2400EP product family Power Budget and
Thermal Configuration Guidelines Tool, available as a download online at
http://www.intel.com.
 The CPU-1 processor + CPU heat sink must be installed first. The CPU-2 heat sink must
be installed at all times, with or without a processor installed.
 Memory Slot population requirements –
o DIMM Population Rules on CPU-1 – Install DIMMs in order; Channels A, B, and
C, Start with1st DIMM (Blue Slot) on each channel, then slot 2.
o DIMM Population Rules on CPU-2 – Install DIMMs in order; Channels D, E, and
F. Start with1st DIMM (Blue Slot) on each channel, then slot 2.
 All hard drive bays must be populated. Hard drive carriers can be populated with a hard
drive or supplied drive blank.
 The air duct must be installed at all times.
 The system top-cover must be installed at all times.