Technical Product Specification

Product Family Overview Intel
®
Server System R1000EP Product Family TPS
8 Intel Order Number G67599-003 Revision 2.0
Parameter
Limits
Servers/Rack
Mount BA
7.0 7.0 7.0 7.0
Disclaimer Note: Intel Corporation server boards contain a number of high-density VLSI and
power delivery components that need adequate airflow to cool. Intel
®
ensures through its own
chassis development and testing that when Intel
®
server building blocks are used together, the
fully integrated system will meet the intended thermal requirements of these components. It is
the responsibility of the system integrator who chooses not to use Intel
®
developed server
building blocks to consult vendor datasheets and operating parameters to determine the amount
of airflow required for their specific application and environmental conditions. Intel Corporation
cannot be held responsible if components fail or the server board does not operate correctly
when used outside any of their published operating or non-operating limits.
See the Intel
®
S2400EP Product Family Power Budget and Thermal Configuration Tool for
system configuration requirements and limitations.
2.3 System Features and Options Overview
Figure 4. System Components Overview