Technical Product Specification

Intel
®
Server System R1000EP Product Family TPS Introduction
Revision 2.0 Intel Order Number G67599-003 1
1. Introduction
This Technical Product Specification (TPS) provides system level information for the Intel
®
Server System R1000EP product family. It describes the functions and features of the
integrated server system which includes the chassis layout, system boards, power sub-system,
cooling sub-system, storage sub-system options, and available installable options. Server board
specific detail can be obtained by referencing the Intel
®
Server Board S2400EP Technical
Product Specification.
In addition, design-level information related to specific server board components/subsystems
can be obtained by ordering External Product Specifications (EPS) or External Design
Specifications (EDS) related to this server generation. EPS and EDS documents are made
available under NDA with Intel
®
and must be ordered through your local Intel
®
representative.
See the Reference Documents section at the end of this document for a complete list of
available documents.
1.1 Chapter Outline
This document is divided into the following chapters:
 Chapter 1 – Introduction
 Chapter 2 – Product Family Overview
 Chapter 3 – Power Subsystem
 Chapter 4 – Thermal Management
 Chapter 5 – System Storage and Peripheral Options
 Chapter 6 – Storage Controller Options Overview
 Chapter 7 – Front Control Panel and I/O Panel Overview
 Chapter 8 – Intel
®
Local Control Panel
 Chapter 9 – PCI Riser Card Support
 Chapter 10 – Mezzanine Module Support
 Appendix A – Integration and Usage Tips
 Appendix B – POST Code Diagnostic LED Decoder
 Appendix C – Post Code Errors
 Glossary
 Reference Documents
1.2 Server Board Use Disclaimer
Intel Corporation server boards support add-in peripherals and contain a number of high-density
VLSI and power delivery components that need adequate airflow to cool. Intel
®
ensures through
its own chassis development and testing that when Intel
®
server building blocks are used
together, the fully integrated system will meet the intended thermal requirements of these
components. It is the responsibility of the system integrator who chooses not to use Intel
®
-
developed server building blocks to consult vendor datasheets and operating parameters to
determine the amount of airflow required for their specific application and environmental
conditions. Intel Corporation cannot be held responsible if components fail or the server board
does not operate correctly when used outside any of their published operating or
non-operating limits.