Technical Product Specification

Introduction Intel® Server System R1304BTSSFAN/ R1304BTLSFAN/ R1304BTLSHBN TPS

 Glossary

 Reference Documents

1.2

Server Board Use Disclaimer

Intel Corporation server boards contain a number of high-density VLSI (Very Large Scale

Integration) and power delivery components that need adequate airflow to cool. Intel ensures

through its own chassis development and testing that when Intel server building blocks are used

together, the fully integrated system meets the intended thermal requirements of these

components. It is the responsibility of the system integrator who chooses not to use Intel

developed server building blocks to consult vendor datasheets and operating parameters to

determine the amount of airflow required for their specific application and environmental

conditions. Intel Corporation cannot be held responsible if components fail or the server board

does not operate correctly when used outside any of their published operating or non-operating

limits.

Revision 2.4