Enclosure Management Cabling for Intel C610 Series Chipset Based Server Systems with Hot-Swap Drive Enclosures

Enclosure Cabling Guide for Intel® C610 Series Chipset Based Server Systems with Hot-Swap Drive Enclosures
Supported
system/
chassis
Backplane P/N
Description
Disk drive slot and cabling connector view
(Two sides of backplane)
TYS;
A: SGPIO connector
B: drive 1
C: Power connector
D: HSBP I2C connector
E: drive 0
Note: For more details of above backplanes, refer to Chapter 5.5 Storage Backplane Option in the Intel
®
Server System R1000WT
Product Family Technical Product Specification, Chapter 6.5 in the Intel
®
Server System R2000WT Product Family Technical
Product Specification and Chapter 5 Hot-swap Backplane in the Intel
®
Server Chassis P4304XXMFEN2/P4304XXMUXX Technical
Product Specification that can be downloaded at http://www.intel.com/support
.
18 October, 2014