Datasheet

Mobile Intel
®
Celeron
®
Processor (0.13 µ)
Micro-FCBGA and Micro-FCPGA Packages Datasheet
298517-006 Datasheet 65
5. Mechanical Specifications
5.1 Socketable Micro-FCPGA Package
The Mobile Intel Celeron Processor is packaged in a 478-pin Micro-FCPGA package. The Low Voltage
and Ultra Low Voltage processors will not be available in this package. The mechanical specifications
for the socketable package are provided in Table 43. Figure 25 through Figure 27 illustrate different
views of the package.
Table 43. Socketable Micro-FCPGA Package Specification
Symbol Parameter Min Max Unit
A Overall height, top of die to package seating plane 1.81 2.03 mm
- Overall height, top of die to PCB surface, including socket(1) 4.69 5.15 mm
A1 Pin length 1.95 2.11 mm
A2 Die height 0.854 mm
B Pin diameter 0.28 0.36 mm
D Package substrate length 34.9 35.1 mm
E Package substrate width 34.9 35.1 mm
D1 Die length
11.18
3
10.82
4
mm
E1 Die width
7.20
3
6.85
4
mm
e Pin pitch 1.27 mm
K Package edge keep-out 5 mm
K1 Package corner keep-out 7 mm
K3 Pin-side capacitor boundary 14 mm
- Pin tip radial true position <=0.254 mm
N Pin count 478 each
Pdie Allowable pressure on the die for thermal solution - 689 kPa
W Package weight 4.5 g
Package surface Flatness 0.286 mm
NOTES:
1. All dimensions are subject to change.
2. Overall height with socket is based on design dimensions of the Micro-FCPGA package and socket with no
thermal solution attached. Values were based on design specifications and tolerances. This dimension is
subject to change based on socket design, OEM motherboard design, or OEM SMT process.
3. Dimension for CPUID = 0x06B1.
4. Dimension for CPUID = 0x06B4.