User Manual

Package Mechanical Specifications
Mobile Intel

Pentium

4 Processor-M Datasheet 63
Table 34. Micro-FCPGA Package Dimensions
NOTES:
1. All Dimensions are subject to change. Values shown are for reference only.
2. Overall height with socket is based on design dimensions of the Micro-FCPGA package and socket with no
thermal solution attached. Values were based on design specifications and tolerances. This dimension is
subject to change based on socket design, OEM motherboard design, or OEM SMT process.
Symbol Parameter Min Max Unit
A Overall height, top of die to package seating plane 1.81 2.03 mm
- Overall height, top of die to PCB surface, including socket(1) 4.69 5.15 mm
A1 Pin length 1.95 2.11 mm
A2 Die height 0.854 mm
A3 Pin-side capacitor height - 1.25 mm
B Pin diameter 0.28 0.36 mm
D Package substrate length 34.9 35.1 mm
E Package substrate width 34.9 35.1 mm
D1 Die length
12.24 (B0 Step)
11.62 (B0 Step Shrink
& C1/D1 Step) mm
E1 Die width
11.93 (B0 Step)
11.34 (B0 Step Shrink
& C1/D1 Step) mm
e Pin pitch 1.27 mm
K Package edge keep-out 5 mm
K1 Package corner keep-out 7 mm
K3 Pin-side capacitor boundary 14 mm
- Pin tip radial true position <=0.254 mm
N Pin count 478 each
Pdie Allowable pressure on the die for thermal solution - 689 kPa
W Package weight 4.5 g
Package Surface Flatness 0.286 mm