Technical Product Specification

Intel® Server System R2000IP Product Family TPS Thermal and Acoustic Management
Revision 1.1
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o Add-in cards with a minimum 100 LFM (0.5 m/s) air flow requirement can be
installed in any available add-in card slot
o Add-in cards with a minimum 200 LFM (1 m/s) air flow requirement can be
installed in any available add-in card slot.
o Add-in cards with a >200 LFM air flow requirement cannot be supported.
o Note: Most PCI add-in cards have minimum air flow requirements of 100 LFM
(0.5m/s). Some high power add-in cards have minimum air flow requirements of
200 LFM (1 m/s). System integrators should verify PCI add-in card air flow
requirements from vendor specifications when integrating add-in cards into the
system.
 The system top-cover must be installed at all times when the system is in operation. The
only exception to this requirement is to hot replace a failed system fan, in which case the
top cover can be removed for no more than 3 minutes at a time
 Supported ambient temperature vs processor TDP is as follow:
4.2 Thermal Management Overview
In order to maintain comprehensive thermal protection and meanwhile deliver best system
acoustic as well as fan power efficiency, an intelligent Fan Speed Control (FSC) and thermal