Technical Product Specification

Design and Environmental Specifications Intel® Server Board S2600IP and Intel® Workstation Board W2600CR TPS
114 Intel order number G34153-004 Revision 1.4
electrical and/or thermal stress and for device maturity. You should view MTBF estimates as
“reference numbers” only.
 Calculation Model: Telcordia* Issue 2, method I case 3
 Operating Temperature: Server in 30°C ambient air
 Operating Environment: Ground Benign, Controlled
 Duty Cycle: 100%
 Quality Level: II
Table 61. Intel
®
Server Board S2600IP MTBF Estimate
Assembly Name
Failure Rate
MTBF
Mother Board
4,981.828605
200,730
Integrated Circuits
888.017556
1,126,104
Transistor_Bipolar
142.288706
7,027,965
Transistor_MOSFET
394.540757
2,534,592
Diodes
24.364143
41,043,923
Diodes_LED
30.002406
33,330,661
Resistors
1,134.467959
881,470
Capacitors
379.972284
2,631,771
Cap, Al Elect
741.486991
1,348,641
Inductors
148.990773
6,711,825
Connections
1,213.354514
824,161
Misc
94.901757
10,537,213
Table 62. Intel
®
Workstation Board W2600CR MTBF Estimate
Assembly Name
Failure Rate
MTBF
Mother Board
5,247.668190
190,561
Integrated Circuits
951.031471
1,051,490
Transistor_Bipolar
147.372000
6,785,549
Transistor_MOSFET
404.110588
2,474,570
Diodes
36.808324
27,167,768
Diodes_LED
30.002406
33,330,661
Resistors
1,204.023273
830,549
Capacitors
413.065171
2,420,925
Cap, Al Elect
770.924084
1,297,145
Inductors
175.282101
5,705,089
Connections
1,216.849949
821,794
Misc
127.585507
7,837,881