Intel I/O Expansion Modules for Intel platforms hardware specification

Intel® I/O Expansion Modules for Intel® Platforms HWS Dual Port FDR InfiniBand* ConnectX*-3 I/O Module

7. Dual Port FDR InfiniBand* ConnectX*-3 I/O Module

(AXX2FDRIBIOM)

Figure 27. Dual Port FDR InfiniBand* ConnectX*-3 I/O Module

7.1

Feature Set

Following is the feature set:

 Mellanox* Connect X-3* FDR/10GbE silicon

 Dual QSFP+ external connectors, standard style QSFP+ cage (not PCI) with EMI spring

fingers and with custom heat sink and retention clip for IOM low profile form factor

 SMB bus isolation and power control to the QSFP+ external connector

 Link (green) and Activity (amber) LEDs for the QSFP+ connection

 16Mbit SPI Flash

 256Byte FRU EEPROM and TMP75 temp sensor (stuffed)

 Stainless steel EMI shield

See Mellanox* Connect X-3* Datasheet for additional silicon and software level features

supported.

Revision 1.2

Intel order number: G30021-004