Intel I/O Expansion Modules for Intel platforms hardware specification

Single Port FDR InfiniBand* ConnectX-3* I/O Module Intel® I/O Expansion Modules for Intel® Platforms HWS
reduced completion time and lower cost per operation. ConnectX-3 with VPI also simplifies
system development by serving multiple fabrics with one hardware design.
6.4.2 Key Features
 1μs MPI ping latency
 Up to 56Gb/s InfiniBand* or 40 Gigabit Ethernet per port
 PCI Express 3.0 (up to 8GT/s)
 CPU offload of transport operations
 Application offload
 GPU communication acceleration
 Precision Clock Synchronization
 End-to-end QoS and congestion control
 Hardware-based I/O virtualization
 Dynamic power management
 Fibre Channel encapsulation (FCoIB or FCoE)
 Ethernet encapsulation (EoIB)
 17mm X 17mm RoHS-R6
6.5
Network LED Functionality
The QSFP+ port on the Single Port FDR InfiniBand* ConnectX*-3 I/O Module will have a green
LED and amber LED. The following is a mapping of LED color, function, and physical location
with respect to the QSFP+ connector.
Table 4. Single Port FDR InfiniBand* ConnectX*-3 I/O Module LED Functionality
LED Color
LED State
NIC State
Amber (Right)
Off
No Activity
Blinking
Transmit / Receive Activity
Green (Left)
Off
No Active Link Connection
On
Active Link Connection
Revision 1.2
Intel order number: G30021-004
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