Technical Product Specification

Intel® Server System R2000IP Product Family TPS Cooling Sub-System
Revision 1.1
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4.3 Processor Heatsink
A heatsink is included in the system package. This heatsink is designed for optimal cooling and
performance. To achieve better cooling performance, you must properly attach the heatsink
bottom base with TIM (thermal interface material), the heatsink is required if necessary.
Figure 23. Processor Heatsink Overview
4.4 System cooling Fans
Six 80x38-mm fans provide the primary airflow for the system. The system is designed for fan
redundancy. Should a single fan fail, the remaining four system fans along with platform
management will provide the necessary air flow and other platform adjustments to maintain
system thermals. Fan redundancy is lost if more than one fan is in a failed state.
Figure 24. System Fan Assembly
The system fan assembly is designed for ease of use and supports several features.
 Each fan is hot-swappable.
 Each fan is designed for tool-less insertion and extraction from the fan assembly.