R2000GZ and R2000GL

Intel
®
Server System R2000GZ/GL Product Family TPS
Appendix D: System Configuration Table for Thermal Compatibility
The following list reflects specified notes identified in the “Support Notes” column in the table. Each note reflects support criteria associated with a
specific system configuration. Notes not specified in the table will reflect support criteria for a R1000GZ/GL Base System SKU described in the
appropriate 1U Technical Product Specification.
Notes:
1. The 25°C configuration alone is limited to elevations of 900m or less
2. Use of the designated PCI slot is limited to add-in cards that have air flow requirements of 100 LFM or less. See add-in card specs for
air flow requirements.
3. Base system SKUs R2312GZ/GL#### and R2224GZ/GL####, configured with the following IO modules: AXX10GBTWLIOM,
AXX2FDRIBIOM, and AXX1FDRIBIOM, can only be supported when DRx8 DIMMs are used.
4. Systems configured with E5-2643(130W-4C), E5-2690(135W-8C), E5-2637 v2(130W-4C) and E5-2643 v2(130W-6C) processors may
experience CPU and or memory throttling, impacting system performance.
5. Processor throttling may occur with a system fan failure which may impact system performance.
6. Specifically for A3/A4 individual Power Supply selection power margin is required to meet thermal specifications:
a) For dual power supply configuration, the power budget must fit within single power supply rated load
b) For single power supply configuration, the power budget must be sized with 30% margin to single power supply rated load.
7. Intel
®
Xeon Phi™ or non-Intel GPGPU cards may have performance impact during ambient excursions
8. When identifying memory in the table, only Rank and Width are required. Capacity is not required.
9. LV refers to low voltage DIMMs (1.35V)
10. Installation of the AXXRMFBU2 in a 2U system will also require installation of Intel mounting bracket A2UBKTMFBUSSD. The Cache
offload Module can only be installed with 95W processor and DRx8 or equivalent memory for HTA A3/A4 with R2312GZ/GL and
R2224GZ/GL System.
11. Confirm the case temperature specification for the SSD to make appropriate selection
12. Fan fail of dual-rotor fans refers to one rotor fail. "Fan Fail Support" indicates if fan fail can be supported with specified configuration in
each column.
13. System must have contents from the Intel accessory kit AGZCOPRODUCT installed to support Intel® Xeon Phi™ or non-Intel GPGPU
add-in cards with passive cooling solutions. Only systems configured with S2600GZ (24-DIMM) server board will be supported.
14. Fan redundancy is not supported in systems configured with 130W-4 Core and 135W-8 Core processors
15. Due to thermal specification availability restrictions, Intel has NOT verified the thermal compatibility of non-Intel GPGPU cards that utilize
a passive cooling solution in its server systems. System integrators should verify non-Intel add-in card air flow requirements from
available vendor specifications before integrating them into the system. See section 5.2 for air flow support limits.
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