Technical Product Specification

Intel® Server Boards S4600LH2/T2 TPS
Revision 2.0
23
Table 9. RDIMM Support Guidelines Intel
®
Xeon
®
processor E5-4600 v2
Ranks Per
DIMM &
Data Width
Memory Capacity
Per DIMM [1]
RDIMM Speed (MT / s) and Voltage Validated for
Short Length PDG by
Slot Per Channel (SPC) and DIMM Per Channel
(DPC)
[2,3,4]
3 Slots per Channel
1 DPC
2 DPC
3 DPC
1.35V
1.5V
1.35V
1.5V
1.35V
1.5V
SRx8
1GB 2GB 4GB
1066,
1333
1066,
1333,
1600,
1866
1066,
1333
1066,
1333,
1600
800
800,
1066
DRx8
2GB 4GB 8GB
1066,
1333
1066,
1333,
1600,
1866
1066,
1333
1066,
1333,
1600
800
800,
1066
SRx4
2GB 4GB 8GB
1066,
1333
1066,
1333,
1600,
1866
1066,
1333
1066,
1333,
1600
800
800,
1066
DRx4
4GB 8GB 16GB
1066,
1333
1066,
1333,
1600,
1866
1066,
1333
1066,
1333,
1600
800
800,
1066
QRx8
4GB 8GB 16GB 800
800,
1066
800 800
QRx4
8GB 16GB 32GB 800
800,
1066
800 800
Notes:
1. Physical Rank is used to calculate DIMM Capacity.
2. Supported and validated DRAM Densities are 2Gb and 4Gb.
3. Command Address Timing is 1N.
4. For Memory Population Rules, please refer to section 3.2.2.2.
5. QR: For 3DPC – Rank Multiplication (RM) = 2; 8R: For 2DPC and 3DPC – Rank Multiplication (RM)
= 4
6. QDP: Quad Die Package DRAM stacking; DDP: Dual Die Package DRAM stacking; P: Planer
monolithic DRAM Die.
Supported, Not Validated
Supported, Limited Validation
Supported and Validated