Technical Product Specification

Product Architecture Overview Intel® Server Boards S4600LH2/T2 TPS
Revision 2.0
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3.1.4 Processor Thermal Design Power (TDP) Support
To allow optimal operation and long-term reliability of Intel processor-based systems, the processor must
remain within the defined minimum and maximum case temperature (T
CASE) specifications. Thermal
solutions not designed to provide sufficient thermal capability may affect the long-term reliability of the
processor and system. The server board is designed to support the Intel® Xeon® processor E5-4600
product family TDP guidelines up to and including 130W.
Disclaimer Note: Intel Corporation server boards contain a number of high-density VLSI and power
delivery components that need adequate airflow to cool. Intel ensures through its own chassis
development and testing that when Intel server building blocks are used together, the fully integrated
system will meet the intended thermal requirements of these components. It is the responsibility of the
system integrator who chooses not to use Intel developed server building blocks to consult vendor
datasheets and operating parameters to determine the amount of airflow required for their specific
application and environmental conditions. Intel Corporation cannot be held responsible if components fail
or the server board does not operate correctly when used outside any of their published operating or
non-operating limits.