Technical Product Specification

Product Architecture Overview Intel® Server Boards S4600LH2/T2 TPS
Revision 2.0
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3.1.1 Processor Socket Assembly
Each processor socket of the server board is pre-assembled with an Independent Latching Mechanism
(ILM) and Back Plate which allow for secure placement of the processor and processor heat to the
server board.
The illustration below identifies each sub-assembly component.
Figure 5. Processor Socket Assembly
The ILM has an 56x94mm heat sink mounting hole pattern and is used on the Intel
®
Server Boards
S4600LH2 and S4600LT2.
Figure 6. Processor Socket ILM
94mm
56mm
Heat Sink
Server Board
Independent Latching
Mechanism (ILM)
Back Plate