Technical Product Specification
Table Of Contents
- 1. Introduction
- 2. Product Family Overview
- 3. Power Subsystem
- 3.1 Mechanical Overview
- 3.2 Power Connectors
- 3.3 Power Supply Module Efficiency
- 3.4 AC and DC Power Cord Specification Requirements
- 3.5 AC Input Specifications
- 3.5.1 Power Factor
- 3.5.2 AC Input Voltage Specification
- 3.5.3 AC Line Isolation Requirements
- 3.5.4 AC Line Dropout/Holdup
- 3.5.5 AC Line Fuse
- 3.5.6 AC Inrush
- 3.5.7 AC Line Transient Specification
- 3.5.8 Susceptibility Requirements
- 3.5.9 Electrostatic Discharge Susceptibility
- 3.5.10 Fast Transient/Burst
- 3.5.11 Radiated Immunity
- 3.5.12 Surge Immunity
- 3.5.13 Power Recovery
- 3.5.14 Voltage Interruptions
- 3.5.15 Protection Circuits
- 3.5.16 Over-current Protection (OCP)
- 3.5.17 Over-voltage Protection (OVP)
- 3.5.18 Over-temperature Protection (OTP)
- 3.6 1600W DC Power Supply Support
- 3.6.1 Power Supply Module Efficiency
- 3.6.2 DC Inlet Connector
- 3.6.3 DC Input Voltage Specification
- 3.6.4 DC Holdup/Dropout Time
- 3.6.5 DC Line Fuse
- 3.6.6 DC Inrush
- 3.6.7 DC Line Surge Voltages (Line Transients)
- 3.6.8 Residual Voltage Immunity in Standby Mode
- 3.6.9 Protection Circuits
- 3.6.10 Over Temperature Protection (OTP)
- 3.7 Cold Redundancy Support
- 3.8 Closed Loop System Throttling (CLST)
- 3.9 Smart Ride Through (SmaRT)
- 3.10 Power Supply Status LED
- 4. Thermal Management
- 5. System Storage and Peripheral Drive Bays Overview
- 6. Storage Controller Options Overview
- 7. Front Control Panel and I/O Panel Overview
- 8. Intel® Local Control Panel
- 9. PCI Riser Card Support
- 10. Additonal System Boards
- 11. Front Panel
- 12. IO Module Support
- 13. Intel® Intelligent Power Node Manager (NM)
- Appendix A: Integration and Usage Tip
- Appendix B: POST Code Diagnostic LED Decoder
- Appendix C: POST Code Errors
- Glossary
- Reference Documents
Introduction Intel® Server System R2000LH2/T2 Product Family TPS
Revision 1.0
2
1.2
Server Board Use Disclaimer
Intel Corporation server boards support add-in peripherals and contain a number of high-density
Very Large Scale Integration (VLSI) and power delivery components that need adequate airflow
to cool. Intel ensures through its own chassis development and testing that when Intel
®
server
building blocks are used together, the fully integrated system will meet the intended thermal
requirements of these components. It is the responsibility of the system integrator who chooses
not to use Intel developed server building blocks to consult vendor datasheets and operating
parameters to determine the amount of airflow required for their specific application and
environmental conditions. Intel Corporation cannot be held responsible if components fail or the
server board does not operate correctly when used outside any of their published operating or
non-operating limits.