S2600GZ and S2600GL

Table Of Contents
Product Architecture Overview Intel® Server Board S2600GZ/GL TPS
Error
Severity
System Action
Processor Intel
®
QuickPath
Interconnect link frequencies not
identical
Fatal
The BIOS detects the QPI link frequencies and responds as follows:
Adjusts all QPI interconnect link frequencies to highest common
frequency.
No error is generated this is not an error condition.
Continues to boot the system successfully.
If the link frequencies for all QPI links cannot be adjusted to be the
same, then this is an error, and the BIOS responds as follows:
Logs the POST Error Code into the SEL.
Alerts the BMC to set the System Status LED to steady Amber.
Displays “0195: Processor Intel
®
QPI link frequencies unable to
synchronize message in the Error Manager.
Does not disable the processor.
Takes Fatal Error action (see above) and will not boot until the fault
condition is remedied.
Processor microcode update missing
Minor
The BIOS detects the error condition and responds as follows:
Logs the POST Error Code into the SEL.
Displays818x: Processor 0x microcode update not found
message in the Error Manager or on the screen.
The system continues to boot in a degraded state, regardless of the
setting of POST Error Pause in the Setup.
Processor microcode update failed
Major
The BIOS detects the error condition and responds as follows:
Logs the POST Error Code into the SEL.
Displays “816x: Processor 0x unable to apply microcode
update” message in the Error Manager or on the screen.
Takes Major Error action. The system may continue to boot in a
degraded state, depending on the setting of POST Error Pause in
Setup, or may halt with the POST Error Code in the Error Manager
waiting for operator intervention.
3.1.4
Processor Thermal Design Power (TDP) Support
To allow optimal operation and long-term reliability of Intel processor-based systems, the processor must
remain within the defined minimum and maximum case temperature (T
CASE) specifications. Thermal solutions
not designed to provide sufficient thermal capability may affect the long-term reliability of the processor and
system. The server board is designed to support the Intel
®
Xeon
®
Processor E5-2600 product family TDP
guidelines up to and including 135W.
Disclaimer Note: Intel Corporation server boards contain a number of high-density VLSI and power delivery
components that need adequate airflow to cool. Intel ensures through its own chassis development and testing
that when Intel server building blocks are used together, the fully integrated system will meet the intended
thermal requirements of these components. It is the responsibility of the system integrator who chooses not to
use Intel developed server building blocks to consult vendor datasheets and operating parameters to
determine the amount of airflow required for their specific application and environmental conditions. Intel
Corporation cannot be held responsible if components fail or the server board does not operate correctly when
used outside any of their published operating or non-operating limits.
3.2
Processor Functions Overview
With the release of the Intel
®
Xeon
®
processor E5-2600 product family, several key system components,
including the CPU, Integrated Memory Controller (IMC), and Integrated IO Module (IIO), have been combined
into a single processor package and feature per socket; two Intel
®
QuickPath Interconnect point-to-point links
capable of up to 8.0 GT/s, up to 40 lanes of Gen 3 PCI Express* links capable of 8.0 GT/s, and 4 lanes of
DMI2/PCI Express* Gen 2 interface with a peak transfer rate of 5.0 GT/s. The processor supports up to 46 bits
of physical address space and 48-bit of virtual address space.
Revision 2.4
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