R2000GZ and R2000GL

Intel
®
Server System R2000GZ/GL Product Family TPS
4. Thermal Management
The fully integrated system is designed to operate at external ambient temperatures of between 10ºC- 35ºC
with limited excursion based operation up to 45ºC, as specified in Table 2. System Environmental Limits
Summary. Working with integrated platform management, several features within the system are designed to
move air in a front to back direction, through the system and over critical components to prevent them from
overheating and allow the system to operate with best performance.
The Intel
®
Server System R2000GZ/GL product family supports short-term, excursion-based, operation up to
45°C (ASHRAE A4) with limited performance impact. The configuration requirements and limitations are
described in the configuration matrix found in Appendix D of this document or in the Intel
®
S2600GZGL
Product Family Power Budget and Thermal Configuration Tool, available as a download online at
http://www.intel.com/support.
The installation and functionality of several system components are used to maintain system thermals. They
include five managed 60mm system fans, one integrated 40mm fan for each installed power supply module, an
air duct, populated hard drive carriers, and installed CPU heats sinks. Hard drive carriers can be populated
with a hard drive or supplied drive blank. In addition, it may be necessary to have specific DIMM slots
populated with DIMMs or supplied DIMM blanks.
4.1 Thermal Operation and Configuration Requirements
To keep the system operating within supported maximum thermal limits, the system must meet the following
operating and configuration guidelines:
• The system operating ambient is designed for sustained operation up to 35ºC (ASHRAE Class A2) with
short term excursion based operation up to 45ºC (ASHRAE Class A4).
o The system can operate up to 40ºC (ASHRAE Class A3) for up to 900 hours per year
o The system can operate up to 45ºC (ASHRAE Class A4) for up to 90 hours per year
o System performance may be impacted when operating within the extended operating
temperature range
o There is no long term system reliability impact when operating at the extended temperature
range within the approved limits.
• Specific configuration requirements and limitations are documented in the configuration matrix found in
Appendix D of this document or in the Intel
®
Server Board S2600GZGL product family Power Budget
and Thermal Configuration Tool, available as a download online at Intel.com.
• The CPU-1 processor + CPU heat sink must be installed first. The CPU-2 heat sink must be installed
at all times, with or without a processor installed.
• Memory Slot population requirements –
• NOTE: Some system configurations may come with pre-installed DIMM blanks. DIMM blanks should
only be removed when installing a DIMM in the same DIMM slot. Memory population rules apply when
installing DIMMs.
o DIMM Population Rules on CPU-1 – Install DIMMs in order; Channels A, B, C, and D
1
. Start
with1st DIMM (Blue Slot) on each channel, then slot 2, then slot 3
1
. Only remove factory
installed DIMM blanks when populating the slot with memory.
o DIMM Population on CPU-2 – Install DIMMs in order; Channels E, F, G, and H
1
. Start with1st
DIMM (Blue Slot) on each channel, then slot 2, then slot 3
1
. Only remove factory installed DIMM
blanks when populating the slot with memory.
o The following system configurations require that specific memory slots be populated at all times
using either a DIMM or supplied DIMM Blank
 System Configuration - 24x 2.5” hard drive bay or 12x 3.5” hard drive bay configuration +
Intel
®
Server Board S2600GZ (24 DIMM server board)
 Memory slots 2 and 3 populated on all memory channels
1
24-DIMM Intel® Server Board S2600GZ only
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