Technical Product Specification

Intel® Server Board S1400SP TPS Functional Architecture
Revision 2.1 Intel order number G64248-003 15
Note: Previous generation Intel
®
Xeon
®
processors are not supported on the Intel
®
server board
described in this document.
Visit the Intel
®
website for a complete list of supported processors.
3.1.1 Processor Socket Assembly
Each processor socket of the server board is pre-assembled with an Independent Latching
Mechanism (ILM) and Back Plate which allow for secure placement of the processor and
processor heat to the server board.
The illustration below identifies each sub-assembly component. (Note: The heat sink styles
may vary.)
Figure 15. Processor Socket Assembly
3.2 Processor Function Overview
With the release of the Intel
®
Xeon
®
processor E5-2400 and the Intel
®
Xeon
®
processor E5-2400
v2 product families, several key system components, including the CPU, Integrated Memory
Controller (IMC), and Integrated IO Module (IIO), have been combined into a single processor
package and feature per socket; One Intel
®
QuickPath Interconnect point-to-point links capable
of up to 8.0 GT/s, up to 24 lanes of Gen 3 PCI Express* links capable of 8.0 GT/s, and 4 lanes
of DMI2/PCI Express* Gen 2 interface with a peak transfer rate of 5.0 GT/s. The processor
supports up to 46 bits of physical address space and 48-bit of virtual address space.