Technical Product Specification

Intel® Server Board S1400SP TPS Glossary
Revision 2.1 Intel order number G64248-003
147
Glossary
This appendix contains important terms used in the preceding chapters. For ease of use,
numeric entries are listed first (for example, “82460GX”) with alpha entries following (for
example, “AGP 4x”). Acronyms are then entered in their respective place, with non-acronyms
following.
Term Definition
ACPI Advanced Configuration and Power Interface
AES Advanced Encryption Standard
AMB Advanced Memory Buffer (there is an AMB on each FBDIMM)
APIC Advanced Programmable Interrupt Controller
ARP Address Resolution Protocol
ASF Alert Standards Forum
ASIC Application specific integrated circuit
BIST Built-in self test
BMC Baseboard management controller
Bridge Circuitry connecting one computer bus to another, allowing an agent on one to access the other.
BSP Bootstrap processor
CBC Chassis bridge controller. A microcontroller connected to one or more other CBCs. Together they
bridge the IPMB buses of multiple chassis.
CLI Command-line interface
CLTT Closed-loop thermal throttling (memory throttling mode)
CMOS In terms of this specification, this describes the PC-AT compatible region of battery-backed 128 bytes
of memory on the server board.
CSR Control and status register
D-cache Data cache. Processor-local cache dedicated for memory locations explicitly loaded and stored by
running code.
DHCP Dynamic Host Configuration Protocol
DIB Device Information Block
DPC Direct Platform Control
EEPROM Electrically erasable programmable read-only memory
EMP Emergency management port
EPS External Product Specification
FML Fast management link
FNI Fast management link network interface
FRB Fault resilient booting
FRU Field replaceable unit
FSB Front side bus
FTM Firmware transfer mode
GPIO General-purpose input/output
HSBP Hot-swap backplane
HSC Hot-swap controller
I-cache Instruction cache. Processor-local cache dedicated for memory locations retrieved through instruction
fetch operations.