Technical Product Specification

IntelP
®
P Server System R1000JP Family TPS Reference Documents
Reference Documents
Refer to the following documents for additional information:
 Intel
®
Server Board S1600JP Technical Product Specification
 ACPI 3.0:
http://www.acpi.info/spec.htm
 IPMI 2.0
 Data Center Management Interface Specification v1.0, May 1, 2008:
www.intel.com/go/dcmi
 PCI Bus Power Management Interface Specification 1.1:
http://www.pcisig.com/
 PCI Express* Base Specification Rev 2.0, Dec 06:
http://www.pcisig.com/
 PCI Express* Card Electromechanical Specification, Rev 2.0:
http://www.pcisig.com/
 PMBus*:
http://pmbus.org
 SATA 2.6:
http://www.sata-io.org/
 SMBIOS 2.4
 SSI-EEB 3.0:
http://www.ssiforum.org/
 USB 1.1:
http://www.usb.org
 USB 2.0:
http://www.usb.org
 Windows* Logo/SDG 3.0
 Intel
®
Dynamic Power Technology Node Manager 1.5 External Interface
Specification using IPMI, 2007. Intel Corporation.
 Node Power and Thermal Management Architecture Specification v1.5, rev.0.79.
2007, Intel Corporation.
 Intel
®
Server System Integrated Baseboard Management Controller Core External
Product Specification, 2007 Intel Corporation.
 Intel
®
Thurley Server Platform Services IPMI Commands Specification, 2007. Intel
Corporation.
 Intel
®
Server Safety and Regulatory, 2011. Intel Corporation. (Intel
®
Order Code:
G23122)
 Intelligent Platform Management Bus Communications Protocol Specification,
Version 1.0, 1998. Intel Corporation, Hewlett-Packard* Company, NEC* Corporation,
Dell* Computer Corporation.
 Platform Environmental Control Interface (PECI) Specification, Version 2.0. Intel
Corporation.
Revision 1.7
Intel order number: G71652-008
84