Technical Product Specification

IntelP
®
P Server System R1000JP Family TPS Thermal Management
4. Thermal Management
The fully integrated system is designed to operate at external ambient temperatures of between
10ºC- 35ºC with limited excursion based operation up to 35ºC, as specified in Table 3.. Working
with integrated platform management, several features within the system are designed to move
air in a front to back direction, through the system and over critical components in order to
prevent them from overheating and allow the system to operate with best performance.
The Intel
®
Server System R1000JP product family supports short-term, excursion-based,
operation up to 35°C (ASHRAE A2) with limited performance impact. The configuration
requirements and limitations are described in the configuration matrix found in the Intel
®
S1600JP Product Family Power Budget and Thermal Configuration Tool, available to download
online at
http://www.intel.com/p/en_US/support.
The installation and functionality of several system components are used to maintain
system thermals.
Note: To support Intel
®
Xeon Processor E5-2690 and E5-2643, the system must change to the
processor heatsink product order code FXXCA84X106HS.
4.1 Thermal Operation and Configuration Requirements
To keep the system operating within supported maximum thermal limits, the system must meet
the following operating and configuration guidelines:
 The system operating ambient is designed for sustained operation up to 35ºC (ASHRAE
Class A2).
o When operating within the extended operating temperature range, then the
system performance may be impacted.
o There is no long term system reliability impact when operating at the extended
temperature range within the approved limits.
 Specific configuration requirements and limitations are documented in the configuration
matrix found in the Intel
®
Server Board S1600JP product family Power Budget and
Thermal Configuration Guidelines Tool, available to download online
at
http://www.intel.com/p/en_US/support
 The processor and the CPU heatsink must be installed first.
 Memory Slot population requirements –
Note: Specified memory slots can be populated with a DIMM or supplied DIMM Blank.
Memory population rules apply when installing DIMMs. Install DIMMs in the order;
Channels A, B, C, and D. Start with the first DIMM (Blue Slot) on each channel, then slot
2. Only remove factory installed DIMM blanks when populating the slot with an actual
memory module.
 All hard drive bays must be populated. Hard drive carriers can be populated with a hard
drive or supplied drive blank.
 The air duct must be installed at all times.
 In single power supply configurations, the second power supply bay must have the
supplied filler blank installed at all times.
 The system top-cover must be installed at all times.
Revision 1.7 35
Intel order number: G71652-008