Technical Product Specification

IntelP
®
P Server System R1000JP Family TPS Product Overview
2. Product Overview
This generation of Intel
®
1U server platforms offers a variety of system options to meet the
varied configuration requirements of high-density high-performance computing environments.
The Intel
®
Server System R1000JP product family is comprised of several available 1U rack
mount server systems that are all integrated with an Intel
®
Server Board S1600JP4.
This chapter provides a high-level overview of the system features. The following chapters
provide greater detail for each major system component or feature.
Figure 1. Product Drawing
Table 1. System Feature Set
Feature
Description
Processor

Support for one Intel
®
Xeon
®
processor E5-2600 / E5-2600 V2 series with a Thermal Design
Power (TDP) of up to 135W (Heatsink product code: FXXEA84X106HS, FXXCA84X106HS for
Intel
®
Xeon
®
E5-2690/2643).
 Support for one Intel
®
Xeon
®
processor E5-1600 / E5-1600 V2 series with a Thermal Design
Power (TDP) of up to 130W (Heatsink product code: FXXCA84X106HS). It can support to 25C
and 900m.
Note: The heatsink which the system integrates can only support 130W (Intel
®
Xeon
®
E5-2643
130W 4 core excluded) or below Intel
®
Xeon
®
Processor E5-2600 series.
Memory
 Maximum DIMM Capacity: 32GB DIMMs.
 Unbuffered DDRIII, Registered DDRIII, and Load Reduced DDRIII.
 Memory DDRIII data transfer rate of 1066/1333/1600MT/s.
 Four memory channels, Two DIMM slots per channel.
 DDR3 standard I/O voltage of 1.5V and DDR3 Low Voltage of 1.35V
Chipset
Intel
®
C600 Platform Controller Hub (PCH) with support for optional Storage Upgrade Key
System
Connectors
External I/O connectors:
 DB-15 Video connectors
Revision 1.7 3
Intel order number: G71652-008