Technical Product Specification

IntelP
®
P Server System R1000JP Family TPS Introduction
1. Introduction
This Technical Product Specification (TPS) provides system specific information detailing the
features, functionality, and high-level architecture of the Intel
®
Server System R1000JP family.
You should also reference the Intel
®
Server Board S1600JP Family Technical Product
Specification to obtain greater detail of functionality and architecture of the server board
integrated in this server system.
In addition, you can obtain design-level information for specific sub-systems by ordering the
External Product Specifications (EPS) or External Design Specifications (EDS) for a given sub-
system. EPS and EDS documents are not publicly available. They are only made available
under NDA with Intel
®
and must be ordered through your local Intel
®
representative. For a
complete list of available documents, refer to the Reference Documents section at the end of
this document.
The Intel
®
Server System R1000JP may contain design defects or errors known as errata which
may cause the product to deviate from published specifications. Refer to the Intel
®
Server Board
S1600JP/Intel
®
Server System R1000JP Specification Update for published errata.
1.1 Chapter Outline
This document is divided into the following chapters:
 Chapter 1 – Introduction
 Chapter 2 – Product Overview
 Chapter 3 – Power Sub-System
 Chapter 4 – Thermal Management
 Chapter 5 – System Storage and Peripheral Options
 Chapter 6 – Storage Controller Options Overview
 Chapter 7 – Front Control Panel and I/O Panel Overview
 Chapter 8 – Intel
®
Local Control Panel
 Chapter 9 – PCI Riser Card Support
 Appendix A – Integration and Usage Tips
 Appendix B – POST Code LED Decoder
 Appendix C – POST Code Errors
 Glossary
 Reference Documents
1.2 Server Board Use Disclaimer
Intel Corporation server boards support add-in peripherals and contain a number of high-density
VLSI and power delivery components that need adequate airflow to cool. Intel
®
ensures through
its own chassis development and testing that when Intel
®
server building blocks are used
together, the fully integrated system will meet the intended thermal requirements of these
components. It is the responsibility of the system integrator who chooses not to use Intel
®
developed server building blocks to consult vendor datasheets and operating parameters to
determine the amount of air flow required for their specific application and environmental
conditions. Intel Corporation cannot be held responsible if components fail or the server board
Revision 1.7
Intel order number: G71652-008
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