Technical Product Specification

Intel® Server Board S1600JP TPS Product Architecture Overview
5. QDP – Quad Die Package DRAM Stacking; DDP – Dual Die Package DRAM stacking; P – Planer
monolithic DRAM Die.
3.3.1.2
Memory Population Rules
Note: All memory on Intel
®
Server Board S1600JP is expected to match in all respects,
including the memory vendor. S1600JP does not support any mix of memory parts, whether or
not a mixed configuration may be able to operate successfully in a particular instance.
The processor provides four banks of memory, each capable of supporting up to four DIMMs.
 DIMMs are organized into physical slots on DDRIII memory channels that belong to
processor sockets.
 The memory channels from the processor socket are identified as Channel A, B, C, and
D. The silk screened DIMM slot identifiers on the board provide information about the
channel. For example, DIMM_A1 is the first slot on Channel A; DIMM_A2 is the second
DIMM socket on Channel A.
On the Intel
®
Server Board S1600JP, a total of eight DIMM slots is provided. The nomenclature
for DIMM sockets is detailed in the following table:
Table 6. Intel
®
Server Board S1600JP DIMM Nomenclature
Processor Socket
(0)
Channel A
(1)
Channel B
(2)
Channel C
(3)
Channel D
A1
B1
C1
D1
A2
B2
C2
D2
Figure 8. Intel
®
Server Board S1600JP DIMM Slot Layout
The following are generic DIMM population requirements that generally apply to the Intel
®
Server Board S1600JP:
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