Technical Product Specification

Intel® Server Board S1600JP TPS Environmental Limits Specifications
9.1
Processor Thermal Design Power (TDP) Support
To allow optimal operation and long-term reliability of Intel
®
processor-based systems, the
processor must remain within the defined minimum and maximum case temperature (T
CASE)
specifications. Thermal solutions not designed to provide sufficient thermal capability may affect
the long-term reliability of the processor and system.
The server board is designed to support
the Intel® Xeon® processor E5-2600 and Intel® Xeon® processor E5-2600 v2 product family
TDP guidelines up to and including 135W or Intel® Xeon® processor E5-1600 and Intel®
Xeon® processor E5-1600 v2 and Intel® Xeon® processor E5-1600 and Intel® Xeon®
processor E5-1600 v2 product family TDP guidelines up to and including 130W.
Disclaimer Note: Intel Corporation server boards contain a number of high-density VLSI and
power delivery components that need adequate airflow to cool. Intel
®
ensures through its own
chassis development and testing that when Intel
®
server building blocks are used together, the
fully integrated system will meet the intended thermal requirements of these components. It is
the responsibility of the system integrator who chooses not to use Intel
®
developed server
building blocks to consult vendor datasheets and operating parameters to determine the amount
of airflow required for their specific application and environmental conditions. Intel Corporation
cannot be held responsible, if components fail or the server board does not operate correctly
when used outside any of their published operating or non-operating limits.
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