Technical Product Specification

Environmental Limits Specifications Intel® Server Board S1600JP TPS
9.
Environmental Limits Specifications
Operation of the server board at conditions beyond those shown in the following table may
cause permanent damage to the system. Exposure to absolute maximum rating conditions for
extended periods may affect long term system reliability.
Note: The Energy Star compliance is at the systems level and not the board level. Use of Intel
®
boards alone does not guarantee Energy Star compliance.
Table 85. Server Board Design Specifications
Operating Temperature
0ºC to 55ºC
1
(32ºF to 131ºF) at product airflow
specification
Non-Operating Temperature
-40ºC to 70ºC (-40ºF to 158ºF)
DC Voltage
± 5% of all nominal voltages
Shock (Unpackaged)
Trapezoidal, 50 G, 170 inches/sec
Shock (Packaged)
<20 pounds
>= 20 to <40 pounds
>= 40 to <80 pounds
>= 80 to <100 pounds
>= 100 to <120 pounds
>= 120 pounds
36 inches
30 inches
24 inches
18 inches
12 inches
9 inches
Vibration (Unpackaged)
5 Hz to 500 Hz 3.13 g RMS random
Note:
Chassis design must provide proper airflow to avoid exceeding the Intel
®
Xeon
®
processor maximum case temperature.
Disclaimer Note: Intel
®
ensures the unpackaged server board and system meet the shock
requirement mentioned above through its own chassis development and system configuration. It
is the responsibility of the system integrator to determine the proper shock level of the board
and system if the system integrator chooses different system configuration or different chassis.
Intel Corporation cannot be held responsible, if components fail or the server board does not
operate correctly when used outside any of its published operating or non-operating limits.
174 Revision 1.9