Technical Product Specification

Product Architecture Overview Intel® Server Board S1600JP TPS
3.2
Processor Support
The server board includes one Socket-R (LGA2011) processor socket and can support the
Intel® Xeon® processor E5-2600 and E5-2600 v2 or Intel® Xeon® processor E5-1600 and E5-
1600 v2 product family, with a Thermal Design Power (TDP) of up to 135W for Intel® Xeon®
processor E5-2600 and E5-2600 v2 product family or up to 130W for Intel® Xeon® processor
E5-1600 and E5-1600 v2 product family.
The Intel
®
Xeon™ E5-2600 processor family is composed of 6/8 cores respectively, and the
Intel
®
Xeon™ E5-1600 processor family is composed of 4/6 cores respectively. The
microprocessors include an integrated DDRIII memory controller (IMC) with four memory
channels which can support up to three ECC Registered DIMMs or three Un-buffered ECC
DIMMs per memory channel, an integrated I/O controller with 40 PCI Express* GenIII lanes
controlled by ten PCI Express* Master Controllers.
Previous generation Intel
®
Xeon
®
processors are not supported on the Intel
®
server boards
described in this document.
Visit the Intel
®
website for a complete list of supported processors.
3.2.1
Processor Socket Assembly
The processor socket of the server board is pre-assembled with an Independent Latching
Mechanism (ILM) and Back Plate that allow for secure placement of the processor and
processor heat to the server board.
The following illustration identifies each sub-assembly component:
Figure 6. Processor Socket Assembly
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