Intel Server System R1000BB Family

Intel
®
Server System R1000BB Product Family TPS
Revision 2.0 65
Appendix D: System Configuration Table for Thermal Compatibility
The following list reflects specified notes identified in the “Support Notes” column in the table. Each note reflects support criteria associated with a
specific system configuration. Notes not specified in the table may reflect support criteria for a R2000BB Base System SKU described in the
appropriate 2U Technical Product Specification.
Notes:
1. The 25°C configuration alone is limited to elevations of 900m or less
2. Use of the designated PCI slot is limited to add-in cards that have air flow requirements of 100 LFM or less. See add-in card specs for air
flow requirements.
3. AXX10GBTWLIOM and AXX2FDRIBIOM with R2312BBxxxx and R2224BBxxxx only supported with no fan fail.
4. Processor and Memory throttling may occur with a system fan failure which may impact system performance.
5. For R1304BBxxxxx and R1208BBxxxxx ,All EN CPU SKUs may have some performance impact under A3 and A4
6. Specifically for A3/A4 individual Power Supply selection power margin is required to meet thermal specifications:
a) For dual power supply configuration, power budget must fit within single power supply rated load and be installed in dual
configuration, or
b) For single power supply configuration, power budget must be sized with 30% margin to single power supply rated load.
7. Intel
®
Xeon Phi™ or non-Intel GPGPU cards may have performance impact during ambient excursions
8. When identifying memory in the table, only Rank and Width are required. Capacity is not required.
9. LV refers to low voltage DIMMs (1.35V)
10. Cache offload Module can only be installed with 95W processor and DRx8 or equivalent memory.
11. Confirm the case temperature specification for the SSD to make appropriate selection
12. Fan fail of dual-rotor fans refers to one rotor fail. "Fan Fail Support" indicates if fan fail can be supported with specified configuration in each
column.