Intel Core2 Extreme Processor QX9775 Thermal and Mechanical Design Guidelines Addendum

Case Temperature Reference Metrology
92 Thermal and Mechanical Design Guidelines
24. You may need to move the solder back toward the groove as the IHS begins to
heat. Use a fine tip tweezers to push the solder into the end of the groove until a
solder ball is built up (see Figure 46 and Figure 47).
Figure 46. View Through Lens at
Solder Station
Figure 47. Moving Solder back onto Thermocouple Bead